Sony hcd nez 50 service manual

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2 HCD-NEZ50 Notes on chip component replacement- Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. T ABLE OF CONTENTS 1. SERVICING NOTES ............................................... 3 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 7 3-2. Cabinet ........................................................................\ ..... 7 3-3. Cabinet (Top) Section ...................................................... 8 3-4. Base Unit (BU-K8BD83S-WOD) ................................... 8 3-5. Front Panel Assy .............................................................. 9 3-6. Mechanical Deck (CMAL5Z235A) ................................ 9 3-7. MAIN Board Block ......................................................... 10 3-8. Tuner (FM/AM) ............................................................... 10 4. TEST MODE .............................................................. 11 5. MECHANICAL ADJUSTMENTS ....................... 12 6. ELECTRICAL ADJUSTMENTS ......................... 13 7. DIAGRAMS 7-1. Block Diagram – CD SERVO Section – ......................... 15 7-2. Block Diagram – MAIN Section – .................................. 16 7-3. Printed Wiring Board – CD Board – ............................... 18 7-4. Schematic Diagram – CD Board – .................................. 19 7-5. Printed Wiring Boards – MAIN Section – ...................... 20 7-6. Schematic Diagram – MAIN Section (1/2) – .................. 21 7-7. Schematic Diagram – MAIN Section (2/2) – .................. 22 7-8. Printed Wiring Board – PANEL Board – ........................ 24 7-9. Schematic Diagram – PANEL Board – ........................... 25 7-10. Printed Wiring Boards – DC Section – ........................... 26 7-11. Printed Wiring Board – AC Board – ................................ 27 7-12. Schematic Diagram – POWER SUPPLY Section – ........ 28 8. EXPLODED VIEWS 8-1. Cabinet Section ................................................................ 34 8-2. Front Mechanical Deck Section ...................................... 35 8-3. PANEL Board Section ..................................................... 36 8-4. Cabinet (Top) Section ...................................................... 37 8-5. MAIN Board Section ....................................................... 38 8-6. AC Board, DC Board Section ......................................... 39 9. ELECTRICAL PARTS LIST ................................ 40 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation e xposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. classified as a CLASS 1 LASER product. This marking is located on the rear exterior. This appliance is Ve r. 1.3 Refer to SUPPLEMENT-1 for the HEAD PHONE board of printed wiring board, schematic diagram and electrical parts list of Argentina and Korean models. When repairing the set of except Argentina and Korean models, refer to either of original service manual/SUPPLEMENT-1 according to the set. Refer to SUPPLEMENT-2 for the PANEL board of printed wiring board, schematic diagram and electrical parts list of Argentina and Korean models. When repairing the set of except Argentina and Korean models, refer to either of original service manual/SUPPLEMENT-2 according to the set.