Sony hcd m 333 service manual
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2 HCD-M333 Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range 87.5 – 108.0 MHz (50 kHz step) AerialFM lead aerial Aerial terminals 75 ohms unbalanced Intermediate frequency10.7 MHz AM tuner section Tuning range European model: 531 – 1,602 kHz (with the tuning interval set at 9 kHz) Other models: 530 – 1,710 kHz (with the tuning interval set at 10 kHz) 531 – 1,602 kHz (with the tuning interval set at 9 kHz) Aerial AM loop aerial, external aerial terminal Intermediate frequency450 kHz GeneralPower requirements European model: 230 V AC, 50/60 Hz Other models: 220 – 240 V AC, 50/60 Hz Power consumption European model: 65 W 0.3 W or less (in Power Saving mode) Other models: 65 WDimensions (w/h/d) incl. projecting parts and controls Amplifier/Tuner/Tape/MD/CD section: Approx. 160 × 217 × 345 mm Mass Amplifier/Tuner/Tape/MD/CD section: Approx. 5.6 kg Design and specifications are subject to change without notice. North American model: 87.5 – 108.0 MHz (100kHz step) Other models: Pan-American model: 530 – 1,710 kHz (with the tuning interval set at 10 kHz) 531 – 1,710 kHz (with the tuning interval set at 9 kHz)North American model: 120 V AC, 60 Hz Korean model: 220 V AC, 60 Hz This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. FOR CD NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. FOR MD NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) The following caution label is located inside the apparatus. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. Ver 1.1 2003.05
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3 HCD-M333 1. SERVICING NOTES ····················································· 10 2. GENERAL ········································································ 14 3. DISASSEMBLY ······························································ 16 3-1. Top Panel Section ······················································· 17 3-2. Cassette Mechanism Deck ········································· 18 3-3. Front Panel Section ···················································· 18 3-4. PANEL Board, H/P Board, LED Board ····················· 19 3-5. Back Panel Section ····················································· 20 3-6. MAIN Board ······························································ 20 3-7. MD Mechanism Deck (MDM-7S2D) ························ 21 3-8. MD DIGITAL Board ·················································· 21 3-9. Holder Assy ································································ 22 3-10. BD (MD) Board ························································· 22 3-11. Motor Section ····························································· 23 3-12. Over Write Head (HR901) ········································· 23 3-13. Mini Disc Device (KMS-262E) ································· 24 3-14. POWER Board, Tuner (FM/AM) ······························· 24 3-15. REG Board, AMP Board ············································ 25 3-16. TRANS Board ···························································· 25 3-17. CD Mechanism Deck (CDM55A-30BBD61B) ········· 26 3-18. Cam (CDM55) ··························································· 26 3-19. Base Unit (BU-30BBD61B) ······································ 27 3-20. Optical Pick Up (BU-30B Assy) ································ 27 4. TEST MODE ···································································· 28 5. ELECTRICAL ADJUSTMENTS TAPE SECTION ·································································· 33 CD SECTION ······································································ 35 MD SECTION ····································································· 36 6. DIAGRAMS ······································································ 44 6-1. Circuit Boards Location ············································· 47 6-2. Block Diagrams – CD Section – ··························································· 48 – MD Section – ·························································· 49 – USB Section – ························································· 50 – MAIN Section – ······················································ 51 TABLE OF CONTENTS SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. 6-3. Printed Wiring Board – BD (CD) Board – ················· 52 6-4. Schematic Diagram – BD (CD) Board – ··················· 53 6-5. Printed Wiring Board – BD (MD) Board – ················ 54 6-6. Schematic Diagram – BD (MD) Board (1/2) – ·········· 55 6-7. Schematic Diagram – BD (MD) Board (2/2) – ·········· 56 6-8. Printed Wiring Board – MD DIGITAL Board – ········ 57 6-9. Schematic Diagram – MD DIGITAL Board (1/2) – ·· 58 6-10. Schematic Diagram – MD DIGITAL Board (2/2) – ·· 59 6-11. Printed Wiring Board – TC Board – ·························· 60 6-12. Schematic Diagram – TC Board – ····························· 61 6-13. Printed Wiring Board – MAIN Section – ··················· 62 6-14. Schematic Diagram – MAIN Section (1/2) – ············· 63 6-15. Schematic Diagram – MAIN Section (2/2) – ············· 64 6-16. Printed Wiring Board – H/P Board – ························· 65 6-17. Schematic Diagram – H/P Board – ···························· 66 6-18. Printed Wiring Board – PANEL Section – ················· 67 6-19. Schematic Diagram – PANEL Section – ···················· 68 6-20. Printed Wiring Board – REG Board / TRANS Board – ································ 69 6-21. Schematic Diagram – REG Board / TRANS Board – 70 6-22. Printed Wiring Board – AMP Board – ······················· 71 6-23. Schematic Diagram – AMP Board – ·························· 72 6-24. Printed Wiring Board – POWER Board – ·················· 73 6-25. Schematic Diagram – POWER Board – ···················· 74 6-26. IC Block Diagrams ····················································· 75 6-27. IC Pin Function Description ······································ 84 7. EXPLODED VIEWS 7-1. Overall Section ··························································· 90 7-2. Front Panel Section ···················································· 91 7-3. Back Panel Section ····················································· 92 7-4. MD Mechanism Deck Section-1 (MDM-7S2D) ········ 93 7-5. MD Mechanism Deck Section-2 (MDM-7S2D) ········ 94 7-6. CD Mechanism Deck Section-1 (CDM55A-30BBD61B) ············································· 95 7-7. CD Mechanism Deck Section-2 (BU-30BBD61B) ··· 96 8. ELECTRICAL PARTS LIST ······································· 97 : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY. Ver 1.1 2003.05