Sony hcd lx 10000 service manual
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Extracted text from sony hcd lx 10000 service manual (Ocr-read)
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2 HCD-LX10000 Notes on chip component replacement-Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Unleaded solder Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screw\ s, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) SAFETY CHECK-OUT To Exposed Metal Par ts on Set 0.15 µF 1.5 kΩ AC V oltmeter (0.75 V) Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. General Power requirements 120 V AC, 60 Hz Power consumption 250 watts Dimensions (w/h/d) (Approx.) 280 × 360 × 398.5 mm Mass (Approx.) 15.6 kg Supplied accessories: Remote Commander (1) Batteries (2) AM loop antenna (1) FM lead antenna (1) Front speaker pads (8) Surround speaker pads (8) Design and specifications are subject to change without notice.
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3 HCD-LX10000 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL Location of Controls ........................................................ 5 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 7 3-2. Side Panel, Top Case ....................................................... 8 3-3. Loading Panel Assy ......................................................... 8 3-4. Front Panel Assy .............................................................. 9 3-5. Tuner Pack ....................................................................... 9 3-6. Tape Mechanism Deck, MIC Board ................................ 10 3-7. PANEL Board, CD-SW Board ........................................ 10 3-8. CD Mechanism Deck ...................................................... 11 3-9. Back Panel ....................................................................... 11 3-10. PRIMARY Board, LIGHTING Board ............................ 12 3-11. Power AMP PC Board Assy, MAIN Board ..................... 12 3-12. SURROUND Board, PA Board ....................................... 13 3-13. Power Transformer (T1200) ............................................ 13 3-14. DRIVER Board, SW Board ............................................. 14 3-15. CD Board, Optical Pick-up (KSM-215DCP/C2NP) ....... 14 3-16. SENSOR Board ............................................................... 15 3-17. MOTOR (TB) Board ....................................................... 15 3-18. MOTOR (LD) Board ....................................................... 16 4. TEST MODE .............................................................. 17 5. MECHANICAL ADJUSTMENTS ....................... 21 6. ELECTRICAL ADJUSTMENTS Deck section .................................................................... 21 CD Section ...................................................................... 22 7. DIAGRAMS ................................................................. 25 7-1. Circuit Boards Location .................................................. 26 7-2. Block Diagram – CD Section – ...................................... 27 7-3. Block Diagram – Tape/Tuner Section – ......................... 28 7-4. Block Diagram – Main Section – ................................... 29 7-5. Block Diagram – AMP Section – ................................... 30 7-6. Block Diagram – Display/Power Section – .................... 31 7-7. Printed Wiring Board – CD Board – .............................. 32 7-8. Schematic Diagram – CD Board – ................................. 33 7-9. Printed Wiring Boards – CD Mechanism Boards – ....... 34 7-10. Schematic Diagram – CD Mechanism Boards – ............ 35 7-11. Printed Wiring Board – MAIN Board – ......................... 36 7-12. Schematic Diagram – MAIN Board (1/3) – ................... 37 7-13. Schematic Diagram – MAIN Board (2/3) – ................... 38 7-14. Schematic Diagram – MAIN Board (3/3) – ................... 39 7-15. Printed Wiring Board – PANEL Board – ....................... 40 7-16. Schematic Diagram – PANEL Board – ........................... 41 7-17. Printed Wiring Boards – CD-SW, JOG, MIC, LIGHTING Boards – ........................................................................\ ... 42 7-18. Schematic Diagram – CD-SW, JOG, MIC, LIGHTING Boards – ........................................................................\ ... 43 7-19. Printed Wiring Board – PA Board – ............................... 44 7-20. Schematic Diagram – PA Board – .................................. 45 7-21. Printed Wiring Boards – TRANS, PRIMARY Boards – 46 7-22. Schematic Diagram – TRANS, PRIMARY Boards – .... 47 7-23. IC Pin Function Description ............................................ 50 8. EXPLODED VIEWS 8-1. Case (Top), Back Panel Section ...................................... 56 8-2. Front Panel Section ......................................................... 57 8-3. Chassis Section ................................................................ 58 8-4. CD Mechanism Deck Section-1 (CDM74-F1BD81) .......................................................... 59 8-5. CD Mechanism Deck Section-2 (CDM74-F1BD81) .......................................................... 60 9. ELECTRICAL PARTS LIST ................................ 61