Sony hcd lf 10 service manual

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2 HCD-LF10 Notes on chip component replacement- Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. This appl iance is classified as a CLASS 1 LASER product. The label is located on the re ar of the control unit. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation e xposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.