Sony hcd hpx 7 service manual
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Extracted text from sony hcd hpx 7 service manual (Ocr-read)
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2 HCD-HPX7 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow-1 ........................................................ 7 3-2. Disassembly Flow-2 ........................................................ 8 3-3. Optical Pick-Up Block .................................................... 9 3-4. Side Plate (L) (R), Top Panel Section .............................. 10 3-5. Mechanical Deck ............................................................. 11 3-6. Front Panel Section ......................................................... 12 3-7. PANEL (1), (2) Board, HEADPHONE Board ................ 12 3-8. Tuner (FM/AM), DC Fan ................................................ 13 3-9. MAIN Board .................................................................... 14 3-10. Rear Panel Section ........................................................... 14 3-11. AMP Board, Switching Regulator ................................... 15 3-12. POWER Board ................................................................ 15 3-13. CD Mechanism Deck (CDM82A) ................................... 16 3-14. Plate (Cover Top) ............................................................. 17 3-15. Top Section ...................................................................... 17 3-16. Arm Section ..................................................................... 18 3-17. CD Mechanism Deck Section ......................................... 19 3-18. Sub Gear (2 Step), Sub Slider Assy ................................. 20 3-19. Arm (R) ........................................................................\ ... 21 3-20. Gear (Stock Planet) (Right) ............................................. 22 3-21. Lever (Sub Gear Back L) ................................................ 22 3-22. Arm (L) ........................................................................\ .... 23 3-23. Gear (Stock Rot Long) (Left) .......................................... 24 3-24. Gear (Stock Rot Short) (Right) ....................................... 24 3-25. Stocker (1) Assy To Stocker (5) Assy .............................. 25 3-26. SPR-E (Roller Slider Upper) (Top Section) .................... 26 3-27. Rubber Roller (Top Section) ........................................... 26 3-28. LOD Motor ...................................................................... 27 3-29. Slider (Push-popup) ......................................................... 27 3-30. Rotary Encoder ................................................................ 28 3-31. Assembling of the Rotary Encoder ................................. 29 3-32. ELV Motor ....................................................................... 30 3-33. Chassis (Top), Chassis (Bottom) ..................................... 31 3-34. Lever (Loading R, Loading L) ........................................ 32 3-35. Disc Stop Lever ............................................................... 33 3-36. DRIVER Board ............................................................... 33 3-37. CD Board ........................................................................\ . 34 3-38. Optical Pick-up (KSM-215DCP) .................................... 34 3-39. Base Unit Section ............................................................ 35 3-40. Lever (BU Lock) ............................................................. 35 3-41. Gear (IDL-B) ................................................................... 36 3-42. Gear (IDL-C) ................................................................... 36 3-43. SPR-E (Tako-Back) ......................................................... 37 3-44. Plate (Push) Assy ............................................................. 38 3-45. SPR-P (Lock) .................................................................. 39 4. ASSEMBLY 4-1. Assembly Flow ................................................................ 40 4-2. Assembling of the Stocker Section ................................. 41 4-3. Assembling of the Gear (Stock Rot Short) (Right) ......... 42 4-4. Assembling of the Gear (Stock Rot Long) (Left) ............ 43 4-5. Confirming the Assembling of the Stocker Section ........ 44 4-6. Assembling of the Gear (Stock Rotary Left) ................... 45 4-7. Assembling of the Gear (Stock Rotary Right) ................ 46 4-8. Assembling of the Lever (Sub Gear Back L) .................. 47 4-9. Assembling of the Gear (Sub Gear Pin Right) ................ 48 4-10. Assembling of the Lever (Sub Gear Back R) .................. 49 4-11. Assembling of the Sub Gear (Idler) ................................ 50 4-12. Assembling of the Sub Gear (2 Step) .............................. 51 4-13. Confirming the Assembling of the Arm Section ............. 52 5. TEST MODE ............................................................... 53 6. ELECTRICAL ADJUSTMENTS .......................... 55 7. DIAGRAMS 7-1. Block Diagram – CD Servo Section – ............................. 59 7-2. Block Diagram – MAIN Section – .................................. 60 7-3. Block Diagram – PANEL/POWER SUPPLY Section – ........................... 61 7-4. Printed Wiring Board – CD Board – ............................... 62 7-5. Schematic Diagram – CD Board – .................................. 63 7-6. Printed Wiring Board – CD MECHANISM Section – .... 64 7-7. Schematic Diagram – CD MECHANISM Section – ...... 65 7-8. Printed Wiring Board – MAIN Board – .......................... 66 7-9. Schematic Diagram – MAIN Board (1/3) – .................... 67 7-10. Schematic Diagram – MAIN Board (2/3) – .................... 68 7-11. Schematic Diagram – MAIN Board (3/3) – .................... 69 7-12. Printed Wiring Board – AMP Board – ............................ 70 7-13. Schematic Diagram – AMP Board – ............................... 71 7-14. Printed Wiring Board – PANEL Section – ...................... 72 7-15. Schematic Diagram – PANEL Section – ......................... 73 7-16. Printed Wiring Board – POWER Board – ....................... 74 7-17. Schematic Diagram – POWER Board – .......................... 75 8. EXPLODED VIEWS 8-1. Side Plate, Top Panel Section .......................................... 83 8-2. Front Panel Section ......................................................... 84 8-3. Chassis Section-1 ............................................................ 85 8-4. Chassis Section-2 ............................................................ 86 8-5. CD Mechanism Deck Section-1 (CDM82A) .................. 87 8-6. CD Mechanism Deck Section-2 (CDM82A) .................. 88 8-7. CD Mechanism Deck Section-3 (CDM82A) .................. 89 8-8. CD Mechanism Deck Section-4 (CDM82A) .................. 90 8-9. CD Mechanism Deck Section-5 (CDM82A) .................. 91 8-10. CD Mechanism Deck Section-6 (CDM82A) .................. 92 8-11. CD Mechanism Deck Section-7 (CDM82A) .................. 93 8-12. CD Mechanism Deck Section-8 (CDM82A) .................. 94 8-13. CD Mechanism Deck Section-9 (CDM82A) .................. 95 8-14. CD Mechanism Deck Section-10 (CDM82A) ................ 96 8-15. Base Unit Section (BU-F1BD81A) ................................. 97 9. ELECTRICAL PARTS LIST .................................. 98
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3 HCD-HPX7 Notes on chip component replacement- Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation e xposure. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.