Sony hcd gx 40 service manual

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3 HCD-GX40 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. TABLE OF CONTENTS 1. GENERAL ·········································································· 4 2. DISASSEMBLY ································································ 6 2-1. Case (Top) ····································································· 6 2-2. CD Door ········································································ 7 2-3. Front Panel Section ······················································· 7 2-4. CD Mechanism Deck (CDM58F-K6A) ························ 8 2-5. Tape Mechanism Deck (CWL43FF48) ························· 8 2-6. REM Board and PANEL Board ···································· 9 2-7. KEY BOARD Board ····················································· 9 2-8. Back Panel Section ······················································ 10 2-9. SUB TRANS Board and VIDEO OUT Board ············ 10 2-10. MAIN Board ······························································· 11 2-11. AMPLIFIER Board and POWER Board ····················· 11 2-12. TRANS Board ····························································· 12 2-13. CD Board and DRIVER Board ··································· 12 2-14. SPDL Board ································································ 13 2-15. Optical Pick-up (KSM-213D) ····································· 13 2-16. MOTOR Board and ADDRESS SENSOR Board ······· 14 2-17. Table (New), Cam (Control) and DC Motor (M721) ······················································· 14 3. TEST MODE ···································································· 15 4. ELECTRICAL ADJUSTMENTS ······························· 17 5. DIAGRAMS ······································································ 19 5-1. Circuit Boards Location ·············································· 19 5-2. Block Diagrams ··························································· 20 5-3. Printed Wiring Boards – CD Section (1/2) – ··············· 22 5-4. Printed Wiring Boards – CD Section (2/2) – ··············· 23 5-5. Schematic Diagram – CD Section – ···························· 24 5-6. Printed Wiring Board – MAIN Section – ···················· 25 5-7. Schematic Diagram – MAIN Section (1/4) – ·············· 26 5-8. Schematic Diagram – MAIN Section (2/4) – ·············· 27 5-9. Schematic Diagram – MAIN Section (3/4) – ·············· 28 5-10. Schematic Diagram – MAIN Section (4/4) – ·············· 29 5-11. Printed Wiring Boards – PANEL Section – ················ 30 5-12. Schematic Diagram – PANEL Section – ····················· 31 5-13. Printed Wiring Boards – POWER/TRANS Section – ······································ 32 5-14. Schematic Diagram – POWER/TRANS Section – ······································ 33 5-15. Printed Wiring Board – AMPLIFIER Section – ·········· 34 5-16. Schematic Diagram – AMPLIFIER Section – ············ 34 5-17. IC Pin Function Description ········································ 38 6. EXPLODED VIEWS ······················································ 40 6-1. Main Section ······························································· 40 6-2. Front Panel Section ····················································· 41 6-3. MAIN Board Section ·················································· 42 6-4. CD Mechanism Deck Section (CDM58F-K6A) ········· 43 7. ELECTRICAL PARTS LIST ······································· 44 Ver 1.2 2003.11