Sony hcd gx 30 service manual

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3 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. HCD-GX30/RG22/RG33 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. TABLE OF CONTENTS ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY. 1. GENERAL ·········································································· 4 2. DISASSEMBLY ································································ 6 2-1. Case (Top) ····································································· 6 2-2. CD Door ········································································ 7 2-3. Front Panel Section ······················································· 7 2-4. CD Mechanism Deck (CDM58F-K6) ·························· 8 2-5. Tape Mechanism Deck (CWL43FF48) ························· 8 2-6. REM Board and PANEL Board ···································· 9 2-7. KEY Board ··································································· 9 2-8. Back Panel Section ····················································· 10 2-9. SUB TRANS Board, VIDEO OUT Board and SENSOR Board ·························································· 10 2-10. MAIN Board ······························································· 11 2-11. POWER Board ···························································· 11 2-12. TRANS Board ···························································· 12 2-13. CD Board and DRIVER Board ··································· 12 2-14. SPDL Board ································································ 13 2-15. Optical Pick-up (KSM-123DCP) ································ 13 2-16. MOTOR Board, ADDRESS SENSOR Board ············ 14 2-17. Table (New), Cam (Control) and DC Motor ··············· 14 3. TEST MODE ···································································· 15 4. ELECTRICAL ADJUSTMENTS ······························· 17 5. DIAGRAMS ······································································ 19 5-1. Circuit Boards Location ·············································· 19 5-2. Block Diagrams ·························································· 20 5-3. Printed Wiring Boards – CD Section (1/2) – ·············· 22 5-4. Printed Wiring Boards – CD Section (2/2) – ·············· 23 5-5. Schematic Diagram – CD Section – ··························· 24 5-6. Printed Wiring Board – MAIN Board – ····················· 25 5-7. Schematic Diagram – MAIN Board (1/4) – ··············· 26 5-8. Schematic Diagram – MAIN Board (2/4) – ··············· 27 5-9. Schematic Diagram – MAIN Board (3/4) – ··············· 28 5-10. Schematic Diagram – MAIN Board (4/4) – ················ 29 5-11. Printed Wiring Boards – PANEL Section – ················ 30 5-12. Schematic Diagram – PANEL Section – ···················· 31 5-13. Printed Wiring Boards – POWER/TRANS Section – 32 5-14. Schematic Diagram – POWER/TRANS Section – ····· 33 5-15. IC Pin Function Description ······································· 36 6. EXPLODED VIEWS ······················································ 38 6-1. Main Section ······························································· 38 6-2. Front Panel Section ····················································· 39 6-3. MAIN Board Section ·················································· 40 6-4. CD Mechanism Deck Section (CDM58F-K6) ··········· 41 7. ELECTRICAL PARTS LIST ······································· 42