Sony hcd gtz 2 gtz 3

Page 2

HCD-GTZZ/GTZZi/GTZ3/GTZ3i
Ver. 1.1

TABLE

1. SERVICING NOTES.

2. DISASSEMBLY
2A1. Disassembly Flow.
2A2. Case (SideAL/R)
2A3. Top Case .............
2A4. Front Panel Block .
2A5. DC Fan (M101)
2A6. Back Panel ......
27. MAIN Board .......................
2A8. DC Fan (M102) (GTZ3/GTZ31),

POWER AMP Board ......................................................
2A9. HUB Board, DMB 19 Board .........
2-10. CD Mechanism Block (CDMBSBADVBUIOI).
2-11. Optical PickAup Block (KHMA313CAB)
2A12. Belt (DLM3A) ....................................

3. TEST MODE ............................................................
4. ELECTRICAL CHECK .........................................

5. DIAGRAMS
5A1. Block Diagram A RF SERVO, USB Section A
5A2. Block Diagram A MAIN Section
5A3. Block Diagram A AMP Section A
5-4. Block Diagram

A PANEL, POWER SUPPLY Section A ...........................
5A5. Primed Wiring Board A DMB19 Board A
5A6. Schematic Diagram A DMB19 Board (1/3)
5A7. Schematic Diagram A DMB19 Board (2/3) A .
5A8. Schematic Diagram A DMB19 Board (3/3)
5A9. Printed Wiring Board A MAIN Board A
5-10. Schematic Diagram A MAIN Board (1/3) A
5-11. Schematic Diagram A MAIN Board (2/3) A
5-12. Schematic Diagram A MAIN Board (3/3) A
513. Printed Wiring Board A HUB Board A .....
5A14. Schematic Diagram A HUB Board A ................................

NOTES ON CHIP COMPONENT REPLACEMENT

' Never reuse a disconnected chip component.

OF CONTENTS

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. 22
. 23
. 24
. 25
. 26

27

Notice that the minus side of a tantalum capacitor may be damA

aged by heat.

FLEXIBLE CIRCUIT BOARD REPAIRING

Keep the temperature of soldering iron around 270 0C during

repairing.

- Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering

or unsoldering.

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE

WITH MARK A ON THE SCHEMATIC DIAGRAMS AND
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS

MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

2

5A15. Printed Wiring Board A POWER AMP Board A .............. 28
5A16. Schematic Diagram A POWER AMP Board

5Al7. Printed Wiring Board A DISPLAY Board A .. 30
5A18. Schematic Diagram A DISPLAY Board A .. 31
5A19. Printed Wiring Boards A PANEL Section A 32
5A2(). Schematic Diagram A PANEL Section A 33
5A21. Printed Wiring Board A TRANSIS Board

(GTZZ: Chilean and Peruvian models) A ......................... 34
5A22. Schematic Diagram A TRANSIS Board

(GTZZ: Chilean and Peruvian models) A ......................... 35
5A23. Printed Wiring Board A TRANSX Board

(GTZZ: Mexican model/GTZZi) A ................................... 36
5A24. Schematic Diagram A TRANSX Board

(GTZZ: Mexican model/GTZ2i) A ................................... 37
5A25. Printed Wiring Board

A TRANS Board (GTZ3/GTZ3i) A ................................... 38
5A26. Schematic Diagram

A TRANS Board (GTZ3/GTZ3i) A ................................... 39

6. EXPLODED VIEWS
6A1. Case Section .....
6A2. Loading Panel Sec on...
6A3. DISPLAY Board Section
6A4. Front Panel Section....
6A5. Back Panel Section .

6A6. MAIN Board Section.
6A7. Chassis Section ...............................................
6A8. CD Mechanism Section (CDMSSBADVBUIOI)

7. ELECTRICAL PARTS LIST .............................. 56

Accessories are given in the last of the electrical parts list.

Note: Refer to supplement-1 for the DISPLAY board of printed
wiring board, schematic diagram and electrical parts list of
Mexican model.

CAUTION

Use of controls or adjustments or periormance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.

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LUOKANr LASERLAWE

KLASSi msempmam

This appliance is classified as a C LA 551
LA SE R product. This marking is located on
the rear exterior.