Sony hcd gp 7 cmt gp7
This is the 62 pages manual for sony hcd gp 7 cmt gp7.
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2 HCD-GP7 1. SERVICING NOTES ··················\ ··················\ ··················\ · 3 2. GENERAL ··················\ ··················\ ··················\ ··················\ ·· 5 3. DISASSEMBLY ··················\ ··················\ ··················\ ·········· 7 3-1. Top Case, MAIN Board, Back Panel Assy ··················\ ·· 8 3-2. Front Panel Assy, CD Mechanism Deck ··················\ ····· 9 3-3. PANEL Board, HP Board, VOL Board ··················\ ····· 10 3-4. TC Board, single cassette mechanism (CMAL1Z240A) ··················\ ··················\ ··················\ ··· 10 3-5. CD Mechanism (CDM55A-K6BD47S) ··················\ ···· 11 3-6. THR Board, DC FAN ··················\ ··················\ ·············· 11 3-7. SPEAKER Board, POWER-AMP Board ··················\ ·· 12 3-8. SUB-POWER Board, POWER Board ··················\ ······· 12 3-9. LOADING Board ··················\ ··················\ ··················\ ·· 13 3-10. CD Board ··················\ ··················\ ··················\ ··············· 13 3-11. Tray (CDM55D) ··················\ ··················\ ··················\ ···· 14 3-12. Optical Pick-Up (KSM-213D) ··················\ ··················\ 14 4. TEST MODE ··················\ ··················\ ··················\ ·············· 16 5. MECHANICAL ADJUSTMENTS ··················\ ··········· 17 6. ELECTRICAL ADJUSTMENTS ··················\ ············· 17 7. DIAGRAMS ··················\ ··················\ ··················\ ················ 22 Contents CIRCUIT BOARD LOCATION ··················\ ··················\ ······ 23 7-1. Block Diagram - CD Section - ··················\ ············· 24 - TUNER/TAPE Section - ··················\ ··················\ ·· 25 - AMP Section - ··················\ ··················\ ················· 26 - DISPLAY/POWER SUPPLY Section - ··············· 27 7-2. Printed Wiring Board - CD Section - ··················\ ··· 28 7-3. Schematic Diagram - CD Section - ··················\ ······ 29 7-4. Printed Wiring Board - TC Section - ··················\ ···· 30 7-5. Schematic Diagram - TC Section - ··················\ ······ 31 7-6. Printed Wiring Board - MAIN Section - ················ 32 7-7. Schematic Diagram - MAIN Section - ··················\ · 33 7-8. Printed Wiring Board - PANEL Section - ·············· 34 7-9. Schematic Diagram - PANEL Section - ················· 35 7-10. Printed Wiring Board - POWER AMP Section - ··· 36 7-11. Schematic Diagram - POWER AMP Section - ······ 37 7-12. Printed Wiring Board - POWER Section - ············· 38 7-13. Schematic Diagram - POWER Section - ··············· 38 8. EXPLODED VIEWS 8-1. Over All Section ··················\ ··················\ ··················\ ···· 47 8-2. Front Panel Section ··················\ ··················\ ················· 48 8-3. Chassis Section ··················\ ··················\ ··················\ ······ 49 8-4. CD Mechanism Section ··················\ ··················\ ··········· 50 8-5. KSM-213D ··················\ ··················\ ··················\ ············ 51 9. ELECTRICAL PARTS LIST ··················\ ··················\ ··· 52 T ABLE OF CONTENTS V er 1.1 2003.11
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3 HCD-GP7 SECTION 1 SERVICING NOTES Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNITNOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the S curve check in CD section adjustment and check that the S curve waveforms is output three times. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C . Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION : Not to Contact with the heat Sink. MAIN board heat sink Lead pin Secure the respective cables firmly with the lead pins so as not to contact them with the heat sink.