Sony hcd fx 200 fx 205
This is the 44 pages manual for sony hcd fx 200 fx 205.
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Extracted text from sony hcd fx 200 fx 205 (Ocr-read)
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HCD-FX200/FX205 2 TABLE OF CONTENTS NOTES ON CHIP COMPONENT REPLACEMENT - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam-aged by heat. FLEXIBLE CIRCUIT BOARD REPAIRING - Keep the temperature of soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those speci fi ed herein may result in hazardous radia- tion exposure. This appliance is classifi ed as a CLASS 1 LASER product. This marking is located on the rear exterior. 1. SERVICING NOTES ............................................. 3 2. DISASSEMBLY 2-1. Disassembly Flow .......................................................... 5 2-2. Panel (Rear) Block ......................................................... 5 2-3. Top Panel Block ............................................................. 6 2-4. Front Panel Block ........................................................... 6 2-5. Knob (VOL) .................................................................... 7 2-6. MAIN Board ................................................................... 7 2-7. Base Unit (BU-D1BD73U) ............................................ 8 2-8. Optical Pick-up Block (DA11MMVGP) ........................ 8 3. TEST MODE ............................................................ 9 4. ELECTRICAL CHECK ......................................... 10 5. DIAGRAMS 5-1. Block Diagram - CD, TUNER, USB Section - ............... 11 5-2. Block Diagram - OUTPUT, PANEL, POWER SUPPLY Section - ......... 12 5-3. Printed Wiring Board - BD73U Board - ........................ 14 5-4. Schematic Diagram - BD73U Board - ........................... 15 5-5. Printed Wiring Board - USB Board - .............................. 16 5-6. Schematic Diagram - USB Board - ................................. 17 5-7. Schematic Diagram - MAIN Section (1/2) - ................... 18 5-8. Schematic Diagram - MAIN Section (2/2) - ................... 19 5-9. Printed Wiring Boards - MAIN Section - ....................... 20 5-10. Printed Wiring Board - PANEL Board - ......................... 21 5-11. Schematic Diagram - PANEL Board (1/2) - ................... 22 5-12. Schematic Diagram - PANEL Board (2/2) - ................... 23 5-13. Printed Wiring Board - PT Board (Except E2, E51 and EA models) - ............. 24 5-14. Schematic Diagram - PT Board (Except E2, E51 and EA models) - ............. 24 5-15. Printed Wiring Board - PT-SW Board (E2, E51 and EA models) - .................. 25 5-16. Schematic Diagram - PT-SW Board (E2, E51 and EA models) - .................. 25 6. EXPLODED VIEWS 6-1. Overall Section .............................................................. 32 6-2. Top Panel Section ........................................................... 33 6-3. Front Panel Section ........................................................ 34 6-4. Chassis Section ............................................................... 35 7. ELECTRICAL PARTS LIST .............................. 36 Accessories are given in the last of the electrical parts list. Ve r. 1 . 1 - Abbreviation E2 : 120V AC area in E model E51 : Chilean and Peruvian models EA : Saudi Arabia model
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HCD-FX200/FX205 3 MODEL IDENTIFICATION - Back Panel - Part No. ModelPart No. FX200: AEP model 4-178-691-0[] FX200: Russian model 4-178-692-0[] FX200: Singapore model 4-178-693-0[] FX200: Australian model 4-178-694-0[] FX200: Taiwan model 4-178-695-0[] FX200: Korean model 4-178-696-0[] FX200: Thai model 4-178-697-0[] FX200: Argentina model 4-178-698-0[] FX200: 120V AC area in E, Chilean and Peruvian models 4-178-699-0 [] FX205: AEP model 4-183-336-0[] FX205: Russian model 4-188-763-0[] LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning on the SW880. (push switch type) The following checking method for the laser diode is operable. - Method Emission of the laser diode is visually checked. 1. Open the upper lid. 2. Push the SW880 as shown in Fig.1. Note: Do not push the detection lever strongly, or it may be bent or damaged. 3. Check the object lens for con fi rming normal emission of the laser diode. If not emitting, there is a trouble in the automatic power control circuit or the optical pick-up. In this operation, the object lens will move up and down 2 times along with inward motion for the focus search. SW880 Fig. 1. Method to push the SW880 SECTION 1 SERVICING NOTES UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fl exible board is easily damaged and should be handled with care. NOTE OF REPLACING THE IC101 ON THE USB BOARD IC101 on the USB board cannot exchange with single. When this part on the USB board is damaged, exchange the entire mounted board. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re fl ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Ve r. 1 . 1