Sony hcd ex 9

Page 2

HCD-EX6/EX6TIEX8IEX8TIEX9/EX9T

General
Power requirements
Mexican model:
AC 127 V. 60 Hz
Argentine model.
AC 220 V. 50160 Hz
Other models:
AC 120 V. 220 V or 230 V - 240 V.
5060 Hz. adjustable with Voltage
selector
Power consumption
HCDVEX9EX9T: [75 w
(0.5 w m the Power Saving Model
l-ICDVEXX/EXST: 170 w
(0.5 w at the Power Savlng Mode)
HCDVEXGEXGT: 110 w
(0.5 w m the Power Saving Mode)
Dimensions (W/l-l/D) (excl. speakers)
Approx, 200 mm x 306 mm x
350 mm
Mass (excl. speakers)
l-lCDrEX9: Approx. 6.7 kg
l-lCDrEX9T: Approx. 7.0 kg
HCDVEXZ: Approx. 6.6 kg
HCDVEXZT: Approx. 6.9 kg
HCDVEXG: Approx. 5.6 kg
l-lCDrEX6T: Approx. 5.9 kg

Design and specifications are Subject to
change without nonce.

NOTES ON CHIP COMPONENT REPLACEMENT
- Never reuse a disconnected chip component.

- Notice that the minus side ofa tantalum capacitor may be dam-

aged by heat.

FLEXIBLE CIRCUIT BOARD REPAIRING

- Keep the temperature of soldering iron around 270 0C during

repairing.

- Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

- Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION

tion exposure.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-

CLASSI LASER PRODUCT

LUOKAN LASERLAITE a CLASS 1 LASER product.

KLASS1 LASERAPPARAT

rear exterior.

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS

MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

2

This appliance is classified as

This marking is located on the

2-1.
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TABLE OF CONTENTS

SERVICING NOTES .. 3
DISASSEMBLY

Side Panel (R)/(L) .. 7
Top Panel Section 7
Tape Mechanism Deck (HCD-EX6T/EX8T/EX9T). 8
Front Panel Section ................................................ 8
MAIN Board 9
Back Panel Section. 10
CD Mechanism Section. 11
Belt (DLM3A). 11
Base Unit ....... 12
BD74 Board .................................................................... 12
TEST MODE ............................................................ 13
MECHANICAL ADJUSTMENTS ...................... 15
ELECTRICAL ADJUSTMENTS ........................ 15
DIAGRAMS

Block Diagram wCD/Tuner Sectionr .............................. 21

Block Diagram ~Tape/Audio Sectioni ...........
Block Diagram -Display/Power Supply Section
Printed Wiring Board 7CD Sectione .
Schematic Diagram ~CD Section»
Printed Wiring Board AUSB Sectione
Schematic Diagram ~USB Section
Printed Wiring Board rPanel Section
Schematic Diagram -Panel Sectioni.
Printed Wiring Board AUSB-JACK See on
Schematic Diagram ~USB-JACK Section».
Printed Wiring Boards -MAIN-AMP Section

Schematic Diagram -MAIN-AMP Section (1/2) . 32
Schematic Diagram ~MAIN-AMP Section (2/2) 33
Printed Wiring Board ePower Supply Sectionm . 34

Schematic Diagram ePower Supply Section-- ................ 35
Schematic Diagram -Tape Deck Section

(HCD-EXGT/EXST/EXQT)- .........
Printed Wiring Board flTape Deck Section
(HCD-EXGT/EXBT/EXHP

36

EXPLODED VIEWS

Overall Section 46
Front Panel Section. 47
Top Panel Section (HCD-EXGT/EXST/EX9T) 48
Chassis Section ............................................... 49
MAIN Board Section ..................... 50
CD Mechanism Section (CDMSSCL»D1BD74UR). 51
ELECTRICAL PARTS LIST .............................. 52

I Accessories are given in the last of the electrical parts list. I