Sony hcd ep 505
This is the 52 pages manual for sony hcd ep 505.
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2 HCD-EP505 Notes on chip component replacement -Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST T he AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a r eturn to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indica- tion is 0.75 V, so analog meters must have an accurate low- v oltage scale. The Simpson 250 and Sanwa SH-63Trd are ex- amples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suit- able. (See Fig. A) CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the bottom. V er 1.1 Fig. A. Using an AC voltmeter to check AC leakage. 1.5 k Ω 0.15 µF AC voltmete r (0.75 V) To Exposed Metal Parts on Set Earth Ground A TTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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3 HCD-EP505 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 7 3-2. Front P anel Section......................................................... 8 3-3. MAIN Board ................................................................... 8 3-4. CD Cabinet Section......................................................... 9 3-5. CD Mechanism Deck (CS-21SC-1280)......................... 9 3-6. Tape Mechanism Deck (CRL3439)................................ 10 3-7. Cassette Lid ..................................................................... 10 4. MECHANICAL ADJUSTMENTS ....................... 11 5. ELECTRICAL ADJUSTMENTS ......................... 11 6. DIAGRAMS 6-1. Block Diagram – TUNER Section –............................. 15 6-2. Block Diagram – TAPE DECK Section –..................... 16 6-3. Block Diagram – MAIN Section –................................ 17 6-4. Block Diagram – DISPLAY/POWER SUPPL Y Section –...................... 18 6-5. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 19 6-6. Printed Wiring Boards – MAIN Section (AEP, UK, Chinese models) –............ 20 6-7. Schematic Diagram – MAIN Section (AEP, UK, Chinese models) (1/3) – ... 21 6-8. Schematic Diagram – MAIN Section (AEP, UK, Chinese models) (2/3) – ... 22 6-9. Schematic Diagram – MAIN Section (AEP, UK, Chinese models) (3/3) – ... 23 6-10. Printed Wiring Boards – MAIN Section (Except AEP, UK, Chinese models) – ............................ 24 6-11. Schematic Diagram – MAIN Section (Except AEP, UK, Chinese models) (1/3) –................... 25 6-12. Schematic Diagram – MAIN Section (Except AEP, UK, Chinese models) (2/3) –................... 26 6-13. Schematic Diagram – MAIN Section (Except AEP, UK, Chinese models) (3/3) –................... 27 6-14. Printed Wiring Board – DISPLAY Section –................ 28 6-15. Schematic Diagram – DISPLAY Section –................... 29 6-16. Printed Wiring Board – POWER Section –................... 30 6-17. Schematic Diagram – POWER Section –..................... 31 6-18. IC Pin Function Description........................................... 34 7. EXPLODED VIEWS 7-1. Cabinet Section ............................................................... 36 7-2. Front P anel Section-1 ...................................................... 37 7-3. Front P anel Section-2 ...................................................... 38 7-4. CD Cabinet Section......................................................... 39 8. ELECTRICAL PARTS LIST ............................... 40 Ver 1.1