Sony hcd e 301 service manual
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Extracted text from sony hcd e 301 service manual (Ocr-read)
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2 HCD-E301 Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. The following caution label is located inside the unit. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 3 2. GENERAL ................................................................... 4 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 6 3-2. Front Panel Section ......................................................... 7 3-3. MAIN Board ................................................................... 7 3-4. CD Cabinet Section ......................................................... 8 3-5. CD Mechanism Deck (CS-21SC-1280) ......................... 8 3-6. Tape Mechanism Deck (TCM125-2) .............................. 9 3-7. Cassette Lid ..................................................................... 9 4. MECHANICAL ADJUSTMENTS ....................... 10 5. ELECTRICAL ADJUSTMENTS ......................... 10 6. DIAGRAMS 6-1. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 13 6-2. Schematic Diagram – MAIN Board (1/2) –.................. 14 6-3. Schematic Diagram – MAIN (2/2)/HEADPHONE Boards –......................... 15 6-4. Printed Wiring Boards – MAIN/HEADPHONE Boards –.................................. 16 6-5. Printed Wiring Board – CASSETTE Board –............... 17 6-6. Schematic Diagram – CASSETTE Board –.................. 17 6-7. Printed Wiring Board – DISPLAY Board –.................. 18 6-8. Schematic Diagram – DISPLAY Board –..................... 19 6-9. Schematic Diagram – POWER Board –........................ 20 6-10. Printed Wiring Board – POWER Board –..................... 21 6-11. IC Pin Function Description ........................................... 23 7. EXPLODED VIEWS 7-1. Cabinet Section ............................................................... 24 7-2. Front Panel Section-1 ...................................................... 25 7-3. Front Panel Section-2 ...................................................... 26 7-4. CD Cabinet Section ......................................................... 27 8. ELECTRICAL PARTS LIST ............................... 28
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3 HCD-E301 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK 1. Press the I/1 button to the power ON with no disc inserted and press the [CD] button. 2. Open the lid for CD. 3. Turn on SW600 as following figure. 4. Confirm the laser diode emission while observing the object- ing lens. When there is no emission, Auto Power Control cir- cuit or Optical Pick-up is broken. Objective lens moves up and down five times for the focus search. SECTION 1 SERVICING NOTES TO PREVENT TAPE OSCILLATION SOUND AT VOLUME MAXIMUM SETTING (W/O TAPE) Headphone wire dressing: a.) Draw the wire from Main board to Headphone Jack board along the bottom side of heatsink. b.) The wire must be kept away from the top side of Cassette board at least 30 mm. SW600 CASSETTE board MAIN board HEADPHONE board at least 30 mm heatsink