Sony hcd dz 555k hcd dz 556k hcd dz 750k

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HCD-DZ555K/DZ556KB/DZ750K
Ver. 1.1

General
Power requirements
Mexican models: 120 V AC, 60 Ht
110 , 240 V AC, 50/60 Hz
Saudi Arabian models. 127 , 240 V AC, 50/60 Ill
Other models: 220 , 240 V AC, 50/60 Hz
Power outpttt (DIGITAL MEDIA PORT)
DC OUT: 5 V. 700 mA
(except for Mexican and
Latin American models)

Latin American models:

Power consumption

DZSSéKB tnodel:

Latin American and Saudi Arabian models:
On: 165 W
Standby: 03 W (at the
Power Savtng mode)

Other models: On: 150 W
Standb ' ,3 W (at the
Power Savtng mode)
DZ750K model: On: 160 W

Standby: 0.3 W (at the
Power Saying mode)

430 X 63 X 380 mm (w/h/d)
incl. ptujccllng parts
DZSSSK/DZSSGKB: 4.1 kg
DZ750K: 4.2 kg

Dimensions (approx)

Mass (approx)

Design and specifications are subject to change
without notice.

Laser component in this product is capable of emitting radiation
exceeding the limit for Class I.

MODEL IDENTIFICATION
- Rear Panel -
L" 6 ® 6 N
Parts No.
Model Part No.
D2555K: SP model 2-896-163-0D
D2555K: AUS model 2-896-163-3D
D2555K: KR model 2-896-163-4D
DZSSSKB: E3 model 3-094-633-3D
DZSSSKB: MX model 3-094-633-4D
D2556KB: E32 model 3-094-633-6D
D2556KB: E12 model 3-094-633-7D
D2556KB: EA model 3-095-152-5D
DZ750K: E3 model 2-896-163-6D
DZ750K: SP model 2-896-163-7D
DZ750K: AUS model 2-896-163-9D

- Abbreviation
AUS : Australian tnodel
E3 : 220 - 240V AC area in E model
E12 : 220 - 240V AC area in E model
E32 : 110 - 240V AC area in E model
EA : Saudi Arabia model
KR : Korean model
MX : Mexican model
SP : Singapore model

This appliance is classified as
a CLASS 1 LASER product.
This marking is located on
the rear exterior.

(Except for Korean model)

CLASS 1 LASER PRODUCT
LUOKAN l LASERLAITE

KLASS 1 LASERAPPARAT

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement
0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270 °C
during repairing.
0 Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
0 Be careful not to apply force on the conductor when soldering
or unsoldering.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead-

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)

9" LEAD FREE MARK
Unleaded solder has the following characteristics.

- Unleaded solder melts at a temperature about 40 C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time
Soldering irons using a temperature regulator should be set to
about 350 DC.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscou~s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
0 Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

Special Component Notice

The components identified by mark El contain confidential
information.

Strictly follow the instructions whenever the components are repaired
and/or replaced.