Sony hcd dx 90

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2 HCD-DX90 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. TABLE OF CONTENTS 1. SERVICE NOTE ······························································· 3 2. GENERAL ·········································································· 4 3. DISASSEMBLY3-1. Disassembly Flow ······························································ 6 3-2. Upper Case (Top) ······························································· 7 3-3. Loading Panel Assy ···························································· 7 3-4. Front Panel Section, CD Mechanism Deck (CDM58-K2BD38) ························· 8 3-5. Tape Mechanism Deck (TCM-230AWP11) ······················· 8 3-6. Panel Board ········································································ 9 3-7. Trans Board ········································································ 9 3-8. MAIN Board, AMP Board ··············································· 10 3-9. Leaf SW Board, Head (A) Board, Head (B) Board ·········· 10 3-10. Base Unit (BU-K2BD38) ················································· 11 3-11. Driver Board, Motor Board, Sensor Board ······················ 11 4. TEST MODE ···································································· 12 5. MECHANICAL ADJUSTMENTS ····························· 16 6. ELECTRICAL ADJUSTMENTS ······························· 16 7. DIAGRAMS7-1. Circuit Boards Location ··················································· 21 7-2. Block Diagrams ································································ 22 7-3. Printed Wiring Board – BD Section – ······························ 24 7-4. Schematic Diagram – BD Section – ································· 25 7-5. Printed Wiring Board – Main Section – ··························· 26 7-6. Schematic Diagram – Main (1/3) Section – ····················· 27 7-7. Schematic Diagram – Main (2/3) Section – ····················· 28 7-8. Schematic Diagram – Main (3/3) Section – ····················· 29 7-9. Printed Wiring Board – Power AMP Section – ················ 30 7-10. Schematic Diagram – Power AMP Section – ··················· 31 7-11. Printed Wiring Board – Panel Section – ··························· 32 7-12. Schematic Diagram – Panel Section – ····························· 33 7-13. Printed Wiring Board – Leaf SW Section – ···················· 34 7-14. Schematic Diagram – Leaf SW Section – ························ 35 7-15. Printed Wiring Board – Driver Section – ························· 36 7-16. Schematic Diagram – Driver Section – ···························· 37 7-17. Printed Wiring Board – Trans Section – ··························· 38 7-18. Schematic Diagram – Trans Section – ····························· 39 7-19. IC Pin Function Description ············································· 40 7-20. IC Block Diagrams ··························································· 42 8. EXPLODED VIEWS8-1. Main Section ····································································· 45 8-2. Panel Section ···································································· 46 8-3. Main Board Section ·························································· 47 8-4. CD Mechanism Deck Section (CDM58-K2BD38) ·········· 48 8-5. Base Unit Section (BU-K2BD38) ···································· 49 8-6. Tape Mechanism Deck Section-1 (TCM-230PWR11) ····· 50 8-7. Tape Mechanism Deck Section-2 (TCM-230PWR11) ····· 51 9. ELECTRICAL PARTS LIST ······································· 52