Sony hcd dx 70
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2 HCD-DX70 TABLE OF CONTENTS 1. GENERAL ·········································································· 4 2. DISASSEMBLY 2-1. Case (Top) ·········································································· 5 2-2. Loading Panel ····································································· 6 2-3. Front Panel Section ···························································· 6 2-4. Tape Mechanism Deck ······················································· 7 2-5. CD SW Board, Panel Board, Pad Switch Board ················ 7 2-6. Main Trans Board ······························································· 8 2-7. Main Board, Power Board ·················································· 8 2-8. SW Board, Head (A) Board, Head (B) Board ···················· 9 2-9. Base Unit ············································································ 9 2-10. Driver Board, Motor Board, CD Sensor Board and Video Board ······································································ 10 3. TEST MODE ···································································· 11 4. MECHANICAL ADJUSTMENTS ····························· 15 5. ELECTRICAL ADJUSTMENTS ······························· 15 6. DIAGRAMS 6-1. Circuit Board Location ····················································· 21 6-2. Block Diagrams ································································ 22 6-3. Schematic Diagram – BD Section – ································· 24 6-4. Printed Wiring Board – BD Section – ······························ 25 6-5. Printed Wiring Board – Main Section – ··························· 26 6-6. Schematic Diagram – Main (1/4) Section – ····················· 27 6-7. Schematic Diagram – Main (2/4) Section – ····················· 28 6-8. Schematic Diagram – Main (3/4) Section – ····················· 29 6-9. Schematic Diagram – Main (4/4) Section – ····················· 30 6-10. Schematic Diagram – Video SW Section – ······················ 31 6-11. Printed Wiring Board – Video SW Section – ··················· 31 6-12. Printed Wiring Board – Power AMP Section – ················ 32 6-13. Schematic Diagram – Power AMP Section – ··················· 33 6-14. Printed Wiring Board – Panel Section – ··························· 34 6-15. Schematic Diagram – Panel Section – ····························· 35 6-16. Printed Wiring Boards – Switch Section – ······················· 36 6-17. Schematic Diagram – Switch Section – ··························· 37 6-18. Printed Wiring Boards – Leaf SW Section – ···················· 38 6-19. Schematic Diagram – Leaf SW Section – ························ 39 6-20. Printed Wiring Boards – Driver Section – ························ 40 6-21. Schematic Diagrams – Driver Section – ·························· 41 6-22. Printed Wiring Board – Trans Section – ··························· 42 6-23. Schematic Diagram – Trans Section – ····························· 43 6-24. IC Pin Functions ······························································· 44 6-25. IC Block Diagrams ··························································· 48 7. EXPLODED VIEWS 7-1. Main Section ····································································· 51 7-2. Front Panel Section ·························································· 52 7-3. Chassis Section ································································· 53 7-4. Tape Mechanism Section-1 (TCM-230MWR41) ············· 54 7-5. Tape Mechanism Section-2 (TCM-230AWR41) ·············· 55 7-6. CD Mechanism Deck Section (CDM58E-30BD60) ········ 56 7-7. Base Unit Section (BU-30BD60) ····································· 57 8. ELECTRICAL PARTS LIST ······································· 58
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3 HCD-DX70 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. MODEL IDENTIFICATION - BACK PANEL - PARTS No. -Abbreviation AR : Argentina model SP : Singapore model MX : Mexican model E51 : Chiri and Peru model MODEL E, E51, AR, SP models MX model PARTS No. 4-231-580-1s 4-231-580-3s SETTING THE TIME This section is extracted from instruction manual.