Sony hcd bx 3 dx3
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2 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY. SAFETY CHECK-OUT (US model only) After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) Earth GroundAC voltmeter (0.75V) 1.5kΩ 0.15µF Fig. A. Using an AC voltmeter to check AC leakage. To Exposed Metal Parts on Set Wavelength 780 – 790 nm Frequency response 2 Hz – 20 kHz (±0.5 dB) Signal-to-noise ratio More than 90 dB Dynamic range More than 90 dB CD OPTICAL DIGITAL OUT (Square optical connector jack, rear panel) Wavelength 660 nm Output Level–18 dBm Tape player section Recording system 4-track 2-channel stereo Frequency response 40 – 13,000 Hz (±3 dB), using Sony TYPE I cassette Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range 87.5 – 108.0 MHz Antenna FM lead antenna Antenna terminals 75 ohm unbalanced Intermediate frequency 10.7 MHz AM tuner section Tuning range US, Canadian, Mexican, Argentina models: 530 – 1,710 kHz (with the interval set at 10 kHz) 531 – 1,710 kHz (with the interval set at 9 kHz) AEP, Saudi Arabia models: 531 – 1,602 kHz (with the interval set at 9 kHz) Other models: 531 – 1,602 kHz (with the interval set at 9 kHz) 530 – 1,710 kHz (with the interval set at 10 kHz) Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz General Power requirements US, Canadian models: 120 V AC, 60 Hz AEP model: 230 V AC, 50/60 Hz Australian model: 230-240 V AC, 50/60 Hz Mexican model: 120 V AC, 50/60 Hz Other models: 120 V, 220 V or 230 - 240 V AC, 50/60 Hz Adjustable with voltage selector Power consumption US model: HCD-BX3: 140 watts Canadian model: HCD-BX3: 130 watts AEP model: HCD-BX3: 130 watts Other models: HCD-DX3: 170 watts Dimensions (w/h/d) HCD-BX3/DX3: Approx. 280 x 325 x 403 mmMass US model: HCD-BX3: Approx. 7.8 kg Canadian model: HCD-BX3: Approx. 7.8 kg AEP model: HCD-BX3: Approx. 7.9 kg Other models: HCD-DX3: Approx. 8.9 kg Design and specifications are subject to change without notice.
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3 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. TABLE OF CONTENTS MODEL IDENTIFICATION - BACK PANEL - MODEL BX3: AEP, UK, G, AED models DX3: AR, E, EA, SP, TW, MY models BX3: US, CND models DX3: AUS, KR, MX, TH models BX3: CIS model PARTS No. 4-224-547-0s 4-224-547-1s 4-224-547-2s 4-224-547-4s 4-226-245-0s -Abbreviation CND : Canadian model AUS : Australian model G : German model AED : North European model EA : Saudi Arabia model MY : Malaysia model PARTS No. 1. SERVICE NOTE ·······························································4 2. GENERAL ··········································································5 3. DISASSEMBY ··································································7 4. TEST MODE ····································································12 5. MECHANICAL ADJUSTMENTS ·····························16 6. ELECTRICAL ADJUSTMENTS ·······························16 7. DIAGRAMS 7-1. Circuit Board Location·················································21 7-2. Block Diagrams····························································22 7-3. Printed Wiring Board BD Section····························24 7-4. Schematic Diagram BD Section·······························25 7-5. Printed Wiring Board Main Section·························26 7-6. Schematic Diagram Main Section (1/3)···················27 7-7. Schematic Diagram Main Section (2/3)···················28 7-8. Schematic Diagram Main Section (3/3)···················29 7-9. Printed Wiring Board AMP Section·························30 7-10. Schematic Diagram AMP Section··························31 7-11. Printed Wiring Board Panel Section·······················32 7-12. Schematic Diagram Panel Section··························33 7-13. Printed Wiring Board Leaf SW Section··················34 7-14. Schematic Diagram Leaf SW Section····················35 7-15. Printed Wiring Board Driver Section······················36 7-16. Schematic Diagram Driver Section························37 7-17. Printed Wiring Board Trans Section·······················38 7-18. Schematic Diagram Trans Section··························39 7-19. IC Pin Function Description·······································40 7-20. IC Block Diagrams·····················································42 8. EXPLODED VIEWS 8-1. Main Section·································································45 8-2. Panel Section································································46 8-3. Main Board Section······················································47 8-4. Tape Mechanism Section··············································48 8-5. CD Mechanism Section················································49 9. ELECTRICAL PARTS LIST ·······································50 SP : Singapore model TH : Thai model TW : Taiwan model KR : Korea model MX : Mexican model AR : Argentina model