Sony f 2 df 19 b 160 service manual

Page 1

FZDF-lQBIBO

SERVICE MANUAL us Model

FORD-car model

Version: -AB

Model Name Using Similar Mechanism NEW
CD Player Mechanism Type MG-SOOF»A

SPECIFICATIONS

System Compact disc digital audio system General

Disc Compact disc Power requirements 12V dc car battery (negative ground)

Laser Semiconductor laser (A = 780nm) Current drain SOOmA (Playback)

Spindle speed 200 rpm. to 500 r.p.m. (CLV) 15A (during disc loading °" 91-3)

Error correction Sony Super Strategy Cross Interleave Operating temperature 40°C 0 +5000 (4° F t° 20° F)
Read Solomon Code Dimensions Approx. 188 x 59x160.6mm lw/h/d)

Number of channels 2 (7~1/2x2-7/20x6-2/5in.)

D-A conversion 18-bit linear including projecting parts and controls

Weight Approx, 1.4kg l3lb), net

Frequency response 20 to 20,000Hzfl :gdB
Harmonic distortion 0.02% (1 kHz)

Dynamic range 85dB

Signal to noise ratio BEdB

Channel separation 70dB

Wow and flutter Below measurable limit

Outputs Ford Signal Connector

Disc

Track pitch 1i6urn

Sampling frequency 44.1 kHz

Quantization 16 bit linear quantizing/ehan nel
Modulation system EFM

Transfer rate 2.03Mbit/sec. (before modulation)

comm DISC PLAYER
SONE

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F2DF-193160

Sect ion

Specif icat ions -----------

Serv

Removing the Flat Package IO --

TABLE OF CONTENTS
Title

icing Note -----------

SECTION 1. SERVICING NOTES -------------- 3
SECTION 2. CIRCUIT DESCRIPTION

Ci

10601 Pins (CXP-EOI i 6) '

I

Compressor ...........

Id
Fu

rcuit Description
C301 Pins(uPD755126F)

entification Sequence
notion of Controls -----

SECTION 3. MECHANICAL ADJUSTMENTS- 11

SECTION 4. ELECTRICAL ADJUSTMENTS-- 12

SEC
5-
5-

5.
5-
5.
5-

SEC
6-
6-
6-
6-

TION 5. DIAGRAMS
1. Printed-OMB SECTION 4
Z. Schenatic Diagram (M) SECTION)

3. Schematic Diagran (MAIN SECTION) - -- 20
4. Pt (MAIN SECTION) ............................ 23
5. Wave forms ------
6. Wave forms -----

TION 6. EXPLODED VIEWS
1. GENERAL -------
2. ND SECTION)
3. ND SECTION (2) '
4. MD SECTIONS) ....

SECTION 7. ELECTRICAL PARTS LIST ----- 33

SERVICING NOTE

Flexible Circuit Board Repairing

0 Keep the temperature of the soldering iron around
270°C during repairing,

0 Do not touch the soldering iron on the same con~
ductor of the circuit board (within 3 times).

0 Be careful not to apply force on the conductor
when soldering or unsoldering.

Notes on chip component replacement

I Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor
may be damaged by heat.

Removing the Flat Package IC

1. Prepare an enameled wire (0.3mm diameter) and

apply it to the back side of the IC pins as illus-
trated below.

Solder or fix with adhesive tape.

2. Heat the IC pin with the soldering iron and draw

the enameled wire so that the IC pin is removed
from the pattern as illustrated.

SA FETY-RELATED COMPONENT WARNINGII

COMPONENTS IDENTIFIED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL T0 SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB
LISHED BY SONY.