Sony excd 31 service manual
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Page 1
EXCD-31
SERVICE MANUAL
US Model
Canadian Model
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
7 watts per Channel minimum continuous average power into
4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more than
1 % total harmonic distortion.
CD player section
System
Signal-to- noise ratio
Frequency response
Wow and flutter
Laser Diode Properties
Material
Wavelength
Emission Duration
Lasci- output power
Compact disc digital audio
system
90 d B
10 - 20,000 Hz
Below measurable limit
CaAlAs
780 nm
Continuous
Less than 44.6 uW
This nuipm is the valiw measured at n distmrcv o] 20!)
mm from Ihv ulnjcctivc lens surface an the Optical Pick»
up Block.
Tuner section
_ FM
Tuning range
Antenm terminal
intermediate frequency
Usable sensitivity
Selectivity
Signal-to-noise ratio
87.5 - 107.9 MHz
External antenna connector
107 MHz
13 dBf
70 dB at 400 kHz
65 dB (stereo),
68 dB (mono)
Model Name Using Similar Mechanism NEW
CD Drive Mechanism Type MG-333X-121
Optical Pick-Up Name KSS-520A
SPECIFICATIONS
Harmonic distortion at I kHz General
05 % (stereo), Output lead
0.3 % (mono)
Separation 33 dB at I kHz
Frequency response 30 - 15,000 Hz Tone controls
Capture ratio 2 dB
A M
Tuning range
Antenna terminal
intermediate frequency
Sensitivity
Power requirements
530 - 1,710 kHz
External antenna connector
450 kHz
32 uv
Dimensions
Mounting dimension
Power amplifier section
Mass
Out uts S eaker out uts . ,
P (gm ml mimmrs) Supplied accessories
Speaker impedance 4 - 8 ohms
Maximum power output 20 W x 4 (at 4 ohms)
Iower antenna cmilrol/
Power amplifier control
lead
Bass :10 dB at 100 Hz
Treble :ll) dB at it) kHz
12 v DC carboltcry
(negative ground)
Approx. 188 x 58 x l80 mm
(7 /:x2><7 /h in.)
(w/h/d)
Approx. 183 x 53 x158 mm
(7 /¢x2 Vixe /4 in.)
(w/h/d)
Approx. 1.3 kg (2 lb 14 oz.)
Parts for installation and
connections (1 set)
Front panel case (i)
Destgn and specifications m subject to change without
naticc.
FM/AM COMPACT msc PLAYER
S ONE
Page 2
TABLE OF CONTENTS
1. GENERAL
Location of Controls ..................................................... 3
Installation . 4
Connections 5
2. DISASSEMBLY ......................................................... 7
3. TEST MODE ............................................................. 11
4. ELECTRICAL ADJUSTMENTS
Tuner Section .................................................................. 11
CD Section ...................................................................... 13
5. DIAGRAMS
5-1. IC Pin Function Description .. . 14
52. Printed Wiring Boards
- Mechanism Deck Section -- ......................................... 16
5-3, Schematic Diagram - Mechanism Deck Section . 19
5-4. Schematic Diagram - Main, Display Section - ..
5-5. Printed Wiring Boards - Main, Display Section - ....... 27
6. EXPLODED VIEWS ................................................ 33
7. ELECTRICAL PARTS LIST ............................... 38
ADDITIONAL
INFORMATION
SE
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL
PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer elec-
trostatic breakdown because of the potential difference gen-
erated by the charged electrostatic load, etc. on clothing and
the human body.
During repair, pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is included
in the repair parts.
The flexible board is easily damaged and should be handled
with care.
Laser Diode Properites
~ Material: GaAlAs
- Wavelength: 780 nm
0 Emission Duration: continuous
. Laser Output Power: less than 44.6 uW*
* This output is the value measured at a distance of 200mm
from the objective lens surface on the Optical Pickup
Block.
CAUTION
Use of controls or adjustments or performance of pro-
cedures other than those specified herein may result in
hazardous radiation exposure.
SAFETY-RELATED COMPONENT WARNINGH
COMPONENTS IDENTIFIED BY MARK A OR DO'ITED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBUSHED BY SONY.
Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270 °C
during repairing.
0 Do not touch the soldering iron on the same conductor of
the circuit board (within 3 timw).
0 Be careful not to apply force on the conductor when solder~
ing or unsoldering.
Notes on chip component replacement
0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may be
damaged by heat,
ATTENTION AU COMPOSANT AYANT RAPPORT
A LA SECURITE!
LES COMPOSANTS IDENTIFIES PAR UNE MARQUE A
SUR LES DIAGRAMMES SCHEMATIOUES ET LA LISTE
DES PIECES SONT CRITIQUES POUR LA SECURITE
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIECES SONY DONT LES
NUMEROS SONT DONNES DANS CE MANUEL OU DANS
LES SUPPLEMENTS PUBLIES PAR SONY.