Sony ecm dm 5 p service manual

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ECM-DM5P 2 z UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. SECTION 1 SERVICING NOTES 1 Twist the lead wire show in arrow direction. 2 Insert the lead wire then return twist. 4 Soldering white lead wire. 5 Screen. 3 Soldering gray lead wire to "V" shape patarn side. 7 Insert the MIC1. Paying attention as lead wire isn't niped in.P1 Lead wire (A32) Case, microphone Arm (rear) Arm (front) C1 MIC1 OK MIC1 Arm (front) Arm (front) NG MIC1MIC1 8 6 Note: When remove solder front P1, change the lead wire (A32) for new one. MIC1 INSTALLATION