Sony dvx 100 service manual
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Extracted text from sony dvx 100 service manual (Ocr-read)
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2 DVX-100 Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK . The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD laser-tap US, Canadian models: AEP, UK models: This product is classified as a CLASS 1 LASER PRODUCT. The CLASS 1 LASER PRODUCT label is located of the rear ex- terior. This label is located on the rear exterior. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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3 DVX-100 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 11 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 15 3-2. Cabinet Assy .................................................................... 16 3-3. Front Panel Assy ............................................................. 16 3-4. MPEG Board ................................................................... 17 3-5. MAIN Board ................................................................... 17 3-6. Mechanism Deck ............................................................. 18 3-7. Top Chassis Assy ............................................................ 18 3-8. DC Motor Assy (Elevator) (M1) ..................................... 19 3-9. Mechanism Panel Assy, Elevator Section ....................... 19 3-10. DC Motor Assy (Loading) (M3) ..................................... 20 3-11. CD Board ......................................................................... 20 3-12. DVD Chassis Assy .......................................................... 21 4. ASSEMBLY 4-1. Adjusting Phase of A Slide Plate, B Slide Plate, C Slide Plate and D Slide Plate ...................................... 22 5. ELECTRICAL ADJUSTMENTS ......................... 23 6. DIAGRAMS 6-1. Block Diagram – SERVO Section – .............................. 25 6-2. Block Diagram – VIDEO/AUDIO Section – ................ 26 6-3. Block Diagram – MAIN Section – ................................ 27 6-4. Block Diagram – CONTROL/POWER Section – ......... 28 6-5. Note for Printed Wiring Boards and Schematic Diagrams ................................................ 29 6-6. Printed Wiring Boards – SERVO Section – .................. 30 6-7. Schematic Diagrams – SERVO Section – ..................... 31 6-8. Printed Wiring Boards – MAIN (Side A)/ADD Boards (Type A, B) – ............... 32 6-9. Printed Wiring Board – MAIN Board (Side B) (Type A, B) – .......................... 33 6-10. Schematic Diagram – MAIN Section (1/4) (Type A, B) – .............................. 34 6-11. Schematic Diagram – MAIN Section (2/4) (Type A, B) – .............................. 35 6-12. Schematic Diagram – MAIN Section (3/4) (Type A, B) – .............................. 36 6-13. Schematic Diagram – MAIN Section (4/4) (Type A, B) – .............................. 37 6-14. Printed Wiring Board – MAIN Board (Side A) (Type C) – ............................... 38 6-15. Printed Wiring Board – MAIN Board (Side B) (Type C) – ............................... 39 6-16. Schematic Diagram – MAIN Section (1/4) (Type C) – .................................. 40 6-17. Schematic Diagram – MAIN Section (2/4) (Type C) – .................................. 41 6-18. Schematic Diagram – MAIN Section (3/4) (Type C) – .................................. 42 6-19. Schematic Diagram – MAIN Section (4/4) (Type C) – .................................. 43 TABLE OF CONTENTS 6-20. Printed Wiring Board – MPEG Board (Component Side) – .............................. 44 6-21. Printed Wiring Board – MPEG Board (Conductor Side) – ................................ 45 6-22. Schematic Diagram – MPEG Section (1/4) – ............... 46 6-23. Schematic Diagram – MPEG Section (2/4) – ............... 47 6-24. Schematic Diagram – MPEG Section (3/4) – ............... 48 6-25. Schematic Diagram – MPEG Section (4/4) – ............... 49 6-26. IC Pin Function Description ........................................... 52 7. EXPLODED VIEWS 7-1. Front Panel, Cabinet Section .......................................... 55 7-2. MPEG Board Section ...................................................... 56 7-3. Bottom Lid Section ......................................................... 57 7-4. Mechanism Deck (Top Chassis Section) ........................ 58 7-5. Mechanism Deck (Front Plate, Slide Plate Section) ...... 59 7-6. Mechanism Deck (Base Chassis Section) ...................... 60 7-7. Mechanism Deck (DVD Chassis Section) ..................... 61 7-8. Mechanism Deck (Elevator Chassis Section) ................ 62 7-9. Mechanism Deck (Clamp Chassis Section) ................... 63 8. ELECTRICAL PARTS LIST ............................... 64 Ver 1.2