Sony dd 1 ex service manual
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Extracted text from sony dd 1 ex service manual (Ocr-read)
Page 2
DD-1EX
TABLE OF CONTENTS
Sect ion Title Page
SECTION 1. SERVICING NOTES . .. ~- . ------ 2
SECTION 2. GENERAL
Locating the Controls ......................... ..
What is an Electronic Book 2 -----------
What is the Electronic Book Player 2 -- -
What You Can Do with the Electronic Book Player"
Choosing a Power Source ........... H.... ...... 5
Connecting the Electronic Book Player to Your TV~ 8
Inserting an Electronic Book - 9
Playing an Electronic Book I0
Adjusting the Contrast ~
Using the Display Light .
Locking the Controls
Playing a Compact Disc
Maintenance-NH ....... ......... 13
SECTION 3. IC PIN DESCRIPTION
ICSII LCD Controller (SEDI336FOA)
IC607 CD-ROM Decorder (LC8951~422)
10802 EXPANDED 1/0 (CXDGIIIQ) --------
Sect ion I it 1e Page
SECTION 4. DISASSEMBLY ------
SECTION 5. ADJUSTMENTS """
SECTION 6. DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION -- . ~ . ----- . .. ' ' 28
6-2.5EMICONDUCTOR LEAD LAYOUTS .
5.3. BLOCK DIAGRAM ...........................
- 21
...... .. 24
6-4. Printed Wiring Boards (MAIN Section) 32
6'5. Schematic Diagram (MAIN Sect ion) -----
66. Schematic Diagram (SERVO Sect ion) ~ - ' ~
67. Printed Wiring Boards (SERVO Section) """ 41
6-8. 1(; Block Diagram ..................... . 44
69. Waveforms ........... .46
SECTION 7. EXPLODED VIEWS
7'1. LCD, BOTTOM SECTION ~~~~~~~~~~~~ ~ ' 48
72 LID CD, CABINET SECTION -~ . .. 49
7'3.MECHANISM SECTION (CUM-DDT) " """""""" 50
SECTION 8. ELECTRICAL PARTS LIST --------- 51
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer
electrostatic breakdown because of the potential difference
generated by the charged electrostatic loadv etc. on clothing
and the human body.
During repair. pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is
included in the repair parts.
The flexible board is easily damaged and should be handled
with care.
Flexible Circuit Board Repairing
0 Keep the temperature of the soldering iron around
270°C during repairing.
0 Do not touch the soldering iron on the same con-
ductor of the circuit board (within 3 times).
0 Be careful not to apply force on the conductor
when soldering or unsoldering.
Notes on chip component replacement
0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor
may be damaged by heat,
Before Replacing the Optical Block
Please be sure to check thoroughly the parameters as par
the Optical Block Checking Procedures (Part No. : 9-960-
027-11) issued separately before replacing the optical block.
Note and specifications required to check are given below.
. FOK output : IC501 @ pin
When checking FOK, remove the solder between
R553 and ICSOI @ pin (FE).
S carve P-to-P value : 295 Vp-p.
Adjusted part for focus gain adjustment: RV503
RF signal P-to-P value : 0.75 e 1.4 Vp-p
Traverse signal P-to-P value : 1.8 Vp-p
The repairing grating holder is impossible.
Adjusted part for tracking gain adjustment : RV504
c.0000
SAFETY-RELATED COMPONENT WARNINGII
COMPONENTS IDENTIFIED BY MARK A 0R DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL T0 SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONV PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.