Sony d vj 85 service manual
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– 2 – TAP802 – main board (side A) – S801 CAUTION Use of controls or adjustments or performance of proce- dures other than those specified herein may result in haz- ardous radiation exposure. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270°C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. Notes on Chip Component Replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat.This Compact Disc player is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT table is located on the bottom exterior. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electro- static breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. Precautions for Checking Emission of Laser Diode Laser light of the equipment is focused by the object lens in the optical pick-up so that the light focuses on the reflection surface of the disc. Therefore, be sure to keep your eyes more then 30 cm apart from the object lens when you check the emission of laser diode. Before Replacing the Optical Pick-Up Block Please be sure to check throughly the parameters as par the Opti- cal Pick-Up Block Checking Procedures (Part No.: 9-960-027- 11) issued separately before replacing the optical pick-up block. Note and specifications required to check are given below. - FOK output : IC601 eg pin When checking FOK, remove the lead wire to disc motor. - RF signal P-to-P value : 0.35 - 0.65 Vp-pLaser Diode Checking Methods During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S801. (push switch type) The following two checking methods for the laser diode are operable. - Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S801 with a screwdriver having a thin tip as shown in Fig.1. or TAP802 is shorted as shown in Fig.2. Note:Do not push the detection lever strongly, or it may be bent or damaged. 3. Press the u button. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will move up and down 5 times along with inward motion for the focus search. Fig. 2 Fig. 1 detection lever detection lever main board S801
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– 3 – TABLE OF CONTENTS 1. GENERAL Getting started ......................................................................... 4 Playing a VIDEO CD .............................................................. 4 Playing an audio CD ................................................................ 5 2. DISASSEMBLY 2-1. Cabinet (Lower) Assy ......................................................... 6 2-2. Lid Assy, Upper ................................................................... 6 2-3. Switch Board ....................................................................... 7 2-4. MD Assy ............................................................................. 7 2-5. Main Board, IR Board ......................................................... 8 2-6. Optical Pick-up ................................................................... 8 3. TEST MODE 3-1. How to Enter the Test Mode ................................................ 9 3-2. How to Release the Test Mode ............................................ 9 3-3. Each Key Function in Test Mode ........................................ 9 4. ELECTRICAL ADJUSTMENT 4-1. Focus Bias Check .............................................................. 11 5. DIAGRAMS 5-1. IC Pin Descriptions ........................................................... 12 5-2. Block Diagram –CD Section (1/2)– .................................. 17 5-3. Block Diagram –CD Section (2/2)– .................................. 19 5-4. Block Diagram –Video Section– ....................................... 21 5-5. Block Diagram –Power Supply Section– .......................... 23 5-6. Printed Wiring Boards ....................................................... 25 5-7. Schematic Diagram –Main Section (1/4)– ........................ 29 5-8. Schematic Diagram –Main Section (2/4)– ........................ 31 5-9. Schematic Diagram –Main Section (3/4)– ........................ 33 5-10. Schematic Diagram –Main Section (4/4)– ........................ 35 6. EXPLODED VIEWS 6-1. Cabinet Section ................................................................. 41 6-2. CD Mechanism Deck Section ........................................... 42 7. ELECTRICAL PARTS LIST ........................................ 43