Sony d sj 303 service manual

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2 D-SJ303 Specifications ........................................................................\ .... 1 1. SERVICING NOTE ................................................... 3 2.GENERAL ................................................................... 3 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 4 3-2. Lid Upper, Cabinet (Front) .......................................... 4 3-3. MD Assy, Main Board ..................................................... 4 3-4. Motor Assy , Turn Table (Spindle) (M901) ................. 5 3-5. Motor Assy (Sled) (M902), Optical Pick-Up (DAX-25E) ........................................... 5 4. ELECTRICAL ADJUSTMENT ............................. 6 5. DIAGRAMS 5-1. IC Pin Function Description ............................................ 7 5-2. Block Diagrams ............................................................... 11 5-3. Printed Wiring Boards – Main Section (1/2) – ................ 12 5-4. Printed Wiring Boards – Main Section (2/2) – ................ 13 5-5. Schematic Diagram – Main Board (1/3) – ...................... 14 5-6. Schematic Diagram – Main Board (2/3) – ...................... 15 5-7. Schematic Diagram – Main Board (3/3) – ...................... 16 6. EXPLODED VIEWS 6-1. Upper Lid Section ........................................................... 18 6-2. Cabinet Section ................................................................ 19 6-3. Optical Pick-Up Section (CDM-3125ER) ....................... 20 7. ELECTRICAL PARTS LIST .................................. 21 TABLE OF CONTENTS Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. D ANGER Invisible laser radiation when open and interlock failed or defeated. A void direct exposure to beam. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Notes on chip component replacement -Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Ve r. 1.1 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PA RTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. A TTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.