Sony d ne 329 sp service manual
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2 D-NE320SP/NE329LIV/NE329SP TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 3 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 6 3-2. Cabinet (Lower), Upper Lid Sub Assy ............................ 6 3-3. JACK Board, Optical Pick-up Assy (CDM-3325ERV) ... 7 3-4. SWITCH Board ............................................................... 7 4. DIAGRAMS ................................................................. 8 4-1. Printed Wiring Board – EGL Board – ............................. 10 4-2. Schematic Diagram – EGL Board – ................................ 11 4-3. Printed Wiring Board – JACK Board (Component Side) – ................................ 12 4-4. Printed Wiring Boards – JACK Board (Conductor Side)/SUB Board – .............. 13 4-5. Schematic Diagram – JACK/SUB Boards – ................... 14 4-6. Printed Wiring Board – SWITCH Board – ......................................................... 15 4-7. Schematic Diagram – SWITCH Board – ......................................................... 15 5. EXPLODED VIEWS 5-1. Upper Lid Section ........................................................... 22 5-2. Cabinet (Lower) Section .................................................. 23 5-3. Optical Pick-up Section (CDM-3325ERV) ..................... 24 6. ELECTRICAL PARTS LIST ................................ 25 Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation e xposure. A TTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. 7 H E N U S I N G A 3 O N Y , 2 3 ' A L K A L I N E B A T T E R Y P R O D U C E D I N * A P A N 2 E C O R D E D A T K B P S 2 E C O R D E D A T K B P S # H A R G I N G T I M E V A R I E S D E P E N D I N G O N H O W T H E R E C H A R G E A B L E B A T T E R Y I S U S E D 3 P E A K E R S T A N D 3 P E A K E R S E C T I O N 3 P E A K E R S Y S T E M M M D I A M E T E R ) M P E D A N C E : 2 A T E D I N P U T P O W E R 7 - A X I M U M I N P U T P O W E R 7 ! M P L I l E R S E C T I O N 2 A T E D O U T P U T 7 7 4 ( $ K ( Z : ) N P U T ) N P U T C O R D W I T H S T E R E O M I N I P L U G S ) N P U T I M P E D A N C E K : A T K ( Z ! 5 8 ) . ' E N E R A L / P E R A T I N G T E M P E R A T U R E # # & & $ I M E N S I O N S W H D E X C L U D I N G P R O J E C T I N G P A R T S A N D C O N T R O L S # $ P L A Y E R ! P P R O X
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3 D-NE320SP/NE329LIV/NE329SP SECTION 1 SERVICING NOTES The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. OPERATION CHECK WHEN THE LID IS OPEN In performing the repair with the power supplied to the set, removing the JACK board causes the set to be disabled. In such a case, make a solder bridge to short SL501 (OPEN) on the JA CK board in advance. – JACK Board (Component Side) – SL501 (OPEN) LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S502. (push switch type) The following checking method for the laser diode is operable. - Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S502 with a screwdriver having a thin tip as shown in Fig. 1. 3. Push the u ENTER button. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pick-up is faulty. In this operation, the objective lens will move up and down 2 times along with inward motion for the focus search. NOTES ON REPLACEMENT OF EGL BOARD OR EEPROM (IC1602) When EGL board is replaced or EEPROM (IC1602) on the EGL board is replaced, patch processing is needed. Confirm about information of patch processing to each service headquarters. Fig. 1 Method to push the S502 S502 lever (detection) lever (detection) JACK board Ver. 1.4