Sony d ne 1 service manual
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2 D-NE1/NE9 TABLE OF CONTENTS 1. SERVICING NOTE ··················\ ··················\ ··················\ ···· 3 2. GENERAL ··················\ ··················\ ··················\ ··················\ ·· 5 3. DISASSEMBLY ··················\ ··················\ ··················\ ·········· 7 3-1. Upper Lid Section ··················\ ··················\ ··················\ ··· 7 3-2. Cabinet (upper) Section ··················\ ··················\ ············· 8 3-3. MAIN Board, CD Mechanism Section (CDM-3325ER2) ··················\ ·· 9 3-4. Motor Assy (Spindle) (M901), Motor Assy (Sled) (M902) Optical Pick-Up Assy (DAX-25E) ················· 10 4. ELECTRICAL CHECKING ··················\ ··················\ ····· 11 5. DIAGRAMS ··················\ ··················\ ··················\ ················ 12 5-1. Block Diagram ··················\ ··················\ ··················\ ······ 13 5-2. Printed Wiring Boards – MAIN Board (Side A) – ······ 14 5-3. Printed Wiring Boards – MAIN Board (Side B) – ······ 15 5-4. Schematic Diagrams – MAIN Board (1/4) – ··············· 16 5-5. Schematic Diagrams – MAIN Board (2/4) – ··············· 17 5-6. Schematic Diagrams – MAIN Board (3/4) – ··············· 18 5-7. Schematic Diagrams – MAIN Board (4/4) – ··············· 19 5-8. IC Block Diagram ··················\ ··················\ ··················\ · 20 5-9. IC Pin Function Descriptions ··················\ ··················\ ·· 21 6. EXPLODED VIEWS ··················\ ··················\ ··················\ 26 7. ELECTRICAL PARTS LIST ··················\ ··················\ ··· 29 Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. On AC power adaptor -U se only the AC power adaptor supplied or recommeded in Accessories (supplied/ optional). Do not use any other AC power adaptor. It may cause a malfunction. Polarity of the plug *1 Measured value by the standard of JEITA (Japan Electronics and Information Technology Industries Association) *2 Charging time varies depending on how the rechargeable battery is used. *3 Recorded at 48 kbps or 64 kbps *4 Recorded at 128 kbps *5 When using Sony alkaline batteries LR6 (SG) (produced in Japan) Operating temperature5°C - 35 °C (41 °F - 95 °F) Dimensions (w/h/d) (excluding projecting parts and controls) Approx. 135.4 × 135.4 × 15.8 mm (5 3⁄8 × 5 3⁄8 × 5⁄8 in.) Mass (excluding accessories)Approx. 179 g (6.4 oz.) Design and specifications are subject to change without notice. Supplied accessoriesAC power adaptor (1) Rechargeable batteries (2) Battery carrying case (1) Headphones / earphones (1) Remote control (1) Charging stand (1) Carrying pouch (1) External battery case (1) CD-ROM (Sonic Stage Simple Burner) (1) Users guide for Sonic Stage Simple Burner (1)
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3 D-NE1/NE9 SECTION 1 SERVICING NOTE The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. BEFORE REPLACING THE OPTICAL PICK-UP BLOCK Please be sure to check thoroughly the parameters as par the Optical\ Pick-Up Block Checking Procedures (Part No.: 9-960-027-11) issued separately before replacing the optical pick-up block. Note and specifications required to check are given below. - FOK output: IC601 yg pin W hen checking FOK, remove the lead wire to disc motor. - RF signal P-to-P value: 0.45 to 0.65 Vp-p LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S820. (push switch type) The following checking method for the laser diode is operable. - Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S820 with a screwdriver having a thin tip as shown in Fig.1. 3. Press the ubutton. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will move up and down 4 times along with inward motion for the focus search. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPÉMENTS PUBLIÉS PAR SONY. Fig. 1 Method to push the S820 S820 detection lever detection leverMAIN board IC601 61 90 IC301 65pin FOK output : MAIN BOARD (SIDE B)