Sony d ej 120 service manual

This is the 26 pages manual for sony d ej 120 service manual.
Read or download the pdf for free. If you want to contribute, please upload pdfs to audioservicemanuals.wetransfer.com.

Page: 1 / 26
sony d ej 120 service manual

Extracted text from sony d ej 120 service manual (Ocr-read)


Page 1

2 D-EJ119/EJ120/EJ121 Flexible Circuit Board Repairing-Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement -Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Unleaded solder Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -U nleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. CAUTION -I NVISIBLE LASER RADIATION WHEN OPEN - DO NOT STARE INTO BEAM OR VIEW DIRECTLY WITH OPTICAL INSTRUMENTS -C LASS 1M INVISIBLE LASER RADIATION WHEN OPEN - DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS Notes on the AC power adaptor -Use only the supplied AC power adaptor. Do not use any other AC power adaptor. - Connect the AC power adaptor to an easily accessible AC outlet. Should you notice an abnormality in the AC power adaptor, disconnect it from the AC outlet immediately. - Do not touch the AC power adaptor with wet hands. Polarity of the plug SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Specifications ........................................................................\ .... 1 1. SERVICING NOTE ................................................... 3 2. GENERAL ................................................................... 4 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 5 3-2. Upper Lid Assy, Cabinet (Upper) Assy, Cabinet (Lower) Assy ...................................................... 5 3-3. CD Mechanism Deck (CDM-3325ERV), Main Board ... 6 3-4. Motor Assy (Sled) (M901), Optical Pick-Up (DAX-25EV), Turn Table Motor Assy (Spindle) (M902) ............................................................. 7 4. ELECTRICAL ADJUSTMENT ............................. 8 5. DIAGRAMS 5-1. Block Diagrams ............................................................... 9 5-2. Printed Wiring Boards – Main Board (Side A) – ............ 10 5-3. Printed Wiring Boards – Main Board (Side B) – ............ 11 5-4. Schematic Diagram – Main Board (1/3) – ...................... 12 5-5. Schematic Diagram – Main Board (2/3) – ...................... 13 5-6. Schematic Diagram – Main Board (3/3) – ...................... 14 5-7. IC Pin Function Description ............................................ 18 6. EXPLODED VIEWS 6-1. Upper Lid Section ........................................................... 20 6-2. Cabinet Section ................................................................ 21 6-3. Optical Pick-Up Section (CDM-3325ERV) .................... 22 7. ELECTRICAL PARTS LIST .................................. 23 TABLE OF CONTENTS A TTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPÉMENTS PUBLIÉS PAR SONY. Ve r. 1.2

Page 2

3 D-EJ119/EJ120/EJ121 SECTION 1 SERVICING NOTE The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. BEFORE REPLACING THE OPTICAL PICK-UP BLOCK Please be sure to check thoroughly the parameters as par the Optical Pick-Up Block Checking Procedures (Part No.: 9-960-027-11) issued separately before replacing the optical pick-up block. -FOK output: IC601 yg pin When checking FOK, remove the lead wire to disc motor. -RF signal P-to-P value: 0.45 to 0.65 Vp-p LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S809. (push switch type) The following checking method for the laser diode is operable. -Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S809 with a screwdriver having a thin tip as shown in Fig.1. 3. Press theubutton. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pickup is faulty. In this operation, the objective lens will move up and down 4 times along with inward motion for the focus search. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT Fig. 1 Method to push the S809 S809lever(lid detection) lever(lid detection) MAIN board TEST MODE The software version display and LCD test can be performed when the test mode is activated. Procedure: 1. Confirm the set is not powered on. (Remove two batteries and disconnect the AC power adaptor.) 2. Short the solder land SL801 (TEST) on the MAIN board. 3. Turn on the main power. (Insert two batteries.) 4. Microcomputer version is displayed for about a second. 5. After that all segments of the liquid crystal display are turned on. 6. Turn off the main power. (Remove two batteries.) 7. Open the solder land SL801 (TEST) on the MAIN board. Note : The solder should be removed clean. IC801 SL801 (TEST) MAIN BOARD (SIDE B)