Sony d 170 an service manual

Page 2

TABLE OF CONTENTS
Specification .. l
1. SERVICING NOTES ....................................................... 2
2. GENERAL ............................................................... 4

3. DISASSEMBLY
3-1. Lid Assy, Upper Removal ........................................... 5
3-2. Cabinet (Front) Assy, MD Assy Removal
3-3. Main Board Removal ..............................

4. SERVICE MODE ............................................................. 7
5. ADJUSTMENTS 8
6. EXPLANATION OF IC TERMINALS ll
7. DIAGRAMS

13
[6
I9

7- I. Block Diagram .........
7-2. Primed Wiring Boards
7-3. Schematic Diagram...

8. EXPLODED VIEWS
S-I . Cabinet Section
8-2. Optical Pick-up Section

27
.. 28

9. ELECTRICAL PARTS LIST ........................................ 29

0-171 La Fiesta" model

The La Fiesta" model is same as the D-l7l C&SA model except
for upper lid assy.

See page 27 for pan No. of upper lid assy.

SAFETY-RELATED COMPONENT WARNINGII

COMPONENTS IDENTIFIED BY MARK AOR DOTTED LINE WITH
MARK AON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN INTHIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.

DANGER
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.

CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation ex-

posure.

This Compact Disc player is
classified as aCLASS l LASER
product.

The CLASS 1 LASER
PRODUCT label is located on
the bottom exterior

CLASS 1 LASER PRODUCT
LUOKAN 1 LASERLAITE

KLASS 1 LASERAPPARAT

Flexlble Circuit Board Repairing

° Keep the temperature of the soldering iron around 270°C during
repairing.

' Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

0 Be careful not to apply force on the conductor when soldering or
unsoldering.

Notes on chip component replacement

- Never reuse a disconnected chip component.

~ Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

ATTENTION AU COMPOSANT AYANT RAPPORT
A LA SECURITEI

LES COMPOSANTS IDENTIFIES PAR UNE MAROUE ASUR LES
DIAGRAMMES SCHEMATIOUES ET LA LISTE DES PIECES
SONT CRITIQUES POUR LA SECURITE DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS OUE PAR DES PIECES
SONY DONT LES NUMEROS SONT DONNES DANS CE MANUEL
OU DANS LES SUPPLEMENTS PUBLIES PAR SONY.

SECTION 1
SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.

The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore. when checking the laser diode emission. ob~
serve from more than 30cm away from the objective lens.

Before Replacing the Optical pick-up Block

Please be sure to check thoroughly the parameters as par the Opti-
cal pick~up Block Checking Procedure (Part No. : 9-960-027-11)
issued separately before replacing the optical Pick»up block.

Note and specifications required to check are given below.

FOK output : IC50] ® pin

When checking FOK, remove the lead wire to disc motor

S curve P»to-P value : 1.2 i 0.3Vp-p ICSO] @ pin.

When checking S curve P-to-P value, remove the lead wire to

disc motor

Adjusted part for focus gain adjustment : RV503
RF signal P-to-P value : 0.8 - 1.2Vp-p

Traverse signal P-to-P value : 1.0 - 2.4Vp-p

The repairing grating holder is impossible.
Adjusted part for tracking gain adjustment : RV502