Sony cmt eh 15
This is the 50 pages manual for sony cmt eh 15.
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HCD-EH15 2 1. SERVICING NOTES ............................................. 3 2. GENERAL .................................................................. 4 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 6 3-2. Rear Cabinet Block ......................................................... 6 3-3. Front Cabinet Block, Top Cabinet Block, MAIN Board ................................................................... 7 3-4. MF-EH10 (Tape Mechanism Deck), Cassette Lid .......... 7 3-5. Base Unit Block (BU-K8BD90-WOD) .......................... 8 3-6. Optical Pick-up Block (KSM-213CDP) ......................... 8 4. TEST MODE ............................................................ 9 5. MECHANICAL ADJUSTMENTS ...................... 10 6. ELECTRICAL ADJUSTMENTS ........................ 10 7. DIAGRAMS 7-1. Printed Wiring Board - CD Board - ................................ 14 7-2. Schematic Diagram - CD Board - ................................... 15 7-3. Printed Wiring Board - PANEL Board - ......................... 16 7-4. Schematic Diagram - PANEL Board - ............................ 17 7-5. Schematic Diagram - MAIN Section (1/2) - ................... 18 7-6. Schematic Diagram - MAIN Section (2/2) - ................... 19 7-7. Printed Wiring Boards - MAIN Section - ....................... 20 8. EXPLODED VIEWS 8-1. Overall Section ............................................................... 27 8-2. Front Cabinet Section ..................................................... 28 8-3. Top Cabinet Section ........................................................ 29 8-4. Base Unit Section (BU-K8BD90-WOD) ........................ 30 9. ELECTRICAL PARTS LIST .............................. 31 Note: Refer to supplement-1 for the MAIN board of printed wiring board, schematic diagram and electrical parts list of Brazil- ian and Thai models. TABLE OF CONTENTS Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. SAFETY-RELATED COMPONET WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC- TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON- NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. This appliance is classified as a CLASS 1 LASER product. This marking is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those speci fi ed herein may result in hazardous radiation exposure. Ve r. 1 . 1
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HCD-EH15 3 SECTION 1 SERVICING NOTES UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostat- ic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fl exible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re fl ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning on the SW750. (push switch type) The following checking method for the laser diode is operable. - Method Emission of the laser diode is visually checked. 1. Open the upper lid. 2. Push the SW750 as shown in Fig.1. Note: Do not push the detection lever strongly, or it may be bent or damaged. 3. Check the object lens for con fi rming normal emission of the laser diode. If not emitting, there is a trouble in the automatic power control circuit or the optical pick-up. In this operation, the object lens will move up and down 2 times along with inward motion for the focus search. SW750 Fig. 1. Method to push the SW750 MODEL IDENTIFICATION Ve r. 1 . 1 Model POWER VOLTAGE INDICATION Canadian and Mexican models AC 120 V, 60 Hz UK and Russian models AC 230 V, 50/60 Hz Australian model AC 230 – 240 V, 50/60 Hz Argentina and Thai models AC 220 V, 50/60 Hz Korean model AC 220 V, 60 Hz Taiwan model AC 120 V, 50/60 Hz Singapore, Chilean and Peruvian models AC 110 – 120 or 220 – 240 V, 50/60 Hz Brazilian model AC 127 or 220 V, 50/60 Hz Power Voltage Indication – Rear Cabinet –