Sony cfd s 300 service manual
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2 General SpeakerFull range: 10 cm dia., 3.2 Ω, cone type (2) Outputs Headphones jack (stereo minijack) For 16 - 68 Ω impedance headphones Po wer output 2.3 W + 2.3 W (at 3.2 Ω, 10% harmonic distortion) Po wer requirements For CD radio cassette-corder: US, CND, E92, MX, TW model: 120 V AC, 60 Hz AU S, SP model: 230 V AC, 50 Hz KR model: 220 V AC, 60 Hz 9 V DC, 6 size D (R20) batteries F or remote control: 3 V DC, 2 size AAA (R03) batteries Po wer consumption AC 14 W Battery life F or CD radio cassette-corder:FM recordingSony R20P: approx. 13.5 hSony alkaline LR20: approx. 20 hTape playbackSony R20P: approx. 7.5 hSony alkaline LR20: approx. 15 hCD playbackSony R20P: approx. 2.5 hSony alkaline LR20: approx. 7 h Dimensions Approx. 414 × 164 × 257 mm (w/h/d) (16 3/8 × 6 1/2 × 10 1/8 inches) (incl. projecting parts) Mass Approx. 3.6 kg (7 lb. 15 oz.) (incl. batteries) Supplied accessories AC pow er cord (1) Remote control (RMT-CS200A) (1) Design and specifications are subject to change without notice. CFD-S300 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of proce- dures other than those specified herein may result in haz- ardous radiation exposure. Flexible Circuit Board Repairing - Ke ep the temperature of the soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on Chip Component Replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. -A bbreviation CND : Canadian model E92 : AC 120V area in E model AU S: Australian model KR : Korean model MX : Mexican model SP : Singapore model TW : Taiwan model V er 1.1
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3 CFD-S300 - UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. TABLE OF CONTENTS 1. SERVICING NOTES ......................................................... 4 2. GENERAL ............................................................................ 5 3. DISASSEMBLY 3-1. Cabinet Top Assy ................................................................ 7 3-2. Cabinet Front Assy, Cabinet Bottom Assy .......................... 7 3-3. Wires ................................................................................... 8 3-4. MD Block ............................................................................ 8 3-5. Cassette Holder ................................................................... 9 3-6. Main Board ......................................................................... 9 3-7. Tuner Board ....................................................................... 10 3-8. Power Board ...................................................................... 10 3-9. CD Lid ............................................................................... 11 3-10. CD Block Assy .................................................................. 11 3-11. Optical Pick-up ................................................................. 12 3-12. R/P Head (HRP301), TC Board ........................................ 12 3-13. Motor Assy (M801), Main Belt (B), Sub Belt (B) ............ 13 4. MECHANICAL ADJUSTMENTS ............................... 14 5. ELECTRICAL ADJUSTMENTS Tape Section .......................................................................... 14 Tuner Section ......................................................................... 15 CD Section ............................................................................ 16 6. DIAGRAMS 6-1. IC Pin Description ............................................................. 17 6-2. Circuit Boards Location .................................................... 17 6-3. Block Diagram – CD Section – ......................................... 18 6-4. Block Diagram – Main Section – ...................................... 19 6-5. Printed Wiring Board – CD Section – ............................... 20 6-6. Schematic Diagram – CD Section – .................................. 21 6-7. Printed Wiring Board – Tuner Section – ........................... 22 6-8. Schematic Diagram – Tuner Section – .............................. 23 6-9. Printed Wiring Boards – Main Section – .......................... 24 6-10. Schematic Diagram – Main Section (1/2) – ...................... 25 6-11. Schematic Diagram – Main Section (2/2) – ...................... 26 6-12. Printed Wiring Board – TC Section – ............................... 27 6-13. Schematic Diagram – TC Section – .................................. 28 6-14. Printed Wiring Boards – Control Section – ....................... 29 6-15. Schematic Diagram – Control Section – ........................... 30 6-16. Printed Wiring Boards – Power Supply Section – ............ 31 6-17. Schematic Diagram – Power Supply Section – ................. 32 6-18. IC Block Diagrams ............................................................ 33 7. EXPLODED VIEWS 7-1. Cabinet Section ................................................................. 36 7-2. Cabinet (Front) Section ..................................................... 37 7-3. Cabinet (Top) (1) Section .................................................. 38 7-4. Cabinet (Top) (2) Section .................................................. 39 7-5. Cabinet (Bottom) Section .................................................. 40 7-6. Tape Mechanism Section .................................................. 41 7-7. CD Mechanism Section .................................................... 42 8. ELECTRICAL PARTS LIST ......................................... 43