Sony cfd s 03cps03cpl

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3 CFD-S03CP/S03CPL TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Cabinet (Rear) Assy ......................................................... 7 3-2. Cabinet (Front) Assy, Cabinet (Upper) Assy ................... 7 3-3. Main Board ...................................................................... 8 3-4. CD Block Assy ................................................................ 8 3-5. BD83S Board .................................................................. 9 3-6. Optical Pick-up ................................................................ 9 3-7. Panel Board ..................................................................... 10 3-8. CD Lid ............................................................................. 10 3-9. Tape Mechanism Block, Belt (1), Belt (2) ...................... 11 3-10. TC Board ......................................................................... 11 3-11. Key-1 Board, Key-2 Board .............................................. 12 3-12. Power Board .................................................................... 12 4. MECHANICAL ADJUSTMENTS ......................... 13 5. ELECTRICAL ADJUSTMENTS Tape Section .................................................................... 13 Tuner Section ................................................................... 14 CD Section ...................................................................... 16 6. DIAGRAMS 6-1. Block Diagram – CD Section – ....................................... 17 6-2. Block Diagram – Main Section – .................................... 18 6-3. Circuit Boards Location .................................................. 19 6-4. Printed Wiring Board – BD83S Section – ....................... 20 6-5. Schematic Diagram – BD83S Section – .......................... 21 6-6. Printed Wiring Board – Main Section – .......................... 22 6-7. Schematic Diagram – Main Section (1/3) – .................... 23 6-8. Schematic Diagram – Main Section (2/3) – .................... 24 6-9. Schematic Diagram – Main Section (3/3) – .................... 25 6-10. Printed Wiring Boards – TC Section – ............................ 26 6-11. Schematic Diagram – TC Section – ................................ 27 6-12. Printed Wiring Boards – Panel Section – ........................ 28 6-13. Schematic Diagram – Panel Section – ............................ 29 6-14. Printed Wiring Boards – Power Supply Section – ........... 30 6-15. Schematic Diagram – Power Supply Section – ............... 31 7. EXPLODED VIEWS 7-1. Rear Cabinet Section ....................................................... 39 7-2. Front Cabinet Section (1) ................................................ 40 7-3. Front Cabinet Section (2) ................................................ 41 7-4. Upper Cabinet Section (1) ............................................... 42 7-5. Upper Cabinet Section (2) ............................................... 43 7-6. CD Mechanism Section ................................................... 44 8. ELECTRICAL PARTS LIST .................................. 45 -UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.