Sony cfd s 01 service manual

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sony cfd s 01 service manual

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2 CFD-S01 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Flexible Circuit Board Repairing - Ke ep the temperature of the soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on Chip Component Replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Notes on DualDiscs A DualDisc is a two sided disc product which mates DVD recorded material on one side with digital audio material on the other side. However, since the audio material side does not conform to the Compact Disc (CD) standard, playback on this product is not guaranteed. Battery life For CD radio cassette-corder: FM recording Sony R14P: approx. 6 h Sony alkaline LR14: approx. 20 h Tape playback Sony R14P: approx. 3 h Sony alkaline LR14: approx. 12 h CD playback Sony R14P: approx. 1.5 h Sony alkaline LR14: approx. 7 h Dimensions Approx. 360 × 141 × 235 mm (w/h/d) 14 1/4 × 5 5/8 × 9 3/8 inches) (incl. projecting parts) Mass Approx. 2.6 kg (5 lb, 11 oz) (incl. batteries) Supplied accessory AC pow er cord (1) Design and specifications are subject to change without notice. SAFETY CHECK-OUT After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST T he AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indica- tion is 0.75 V, so analog meters must have an accurate low- v oltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A) 1.5 k Ω 0.15 µF AC voltmete r (0.75 V) To Exposed Metal Parts on Set Earth Ground Fig. A. Using an AC voltmeter to check AC leakage.

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3 CFD-S01 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Cabinet (Rear) Assy ......................................................... 7 3-2. Cabinet (Front) Assy, Cabinet (Upper) Assy ................... 7 3-3. Main Board ...................................................................... 8 3-4. CD Block Assy ................................................................ 8 3-5. CD Motor Board .............................................................. 9 3-6. Optical Pick-up ................................................................ 9 3-7. Control Board .................................................................. 10 3-8. CD Lid ............................................................................. 10 3-9. Tape Mechanism Block, Belt (1), Belt (2) ...................... 11 3-10. TC Board ......................................................................... 11 3-11. Key (FUNC) Board, Key (VOL) Board .......................... 12 3-12. Power Board .................................................................... 12 4. MECHANICAL ADJUSTMENTS ......................... 13 5. ELECTRICAL ADJUSTMENTS Tape Section .................................................................... 13 Tuner Section ................................................................... 14 CD Section ...................................................................... 16 6. DIAGRAMS 6-1. Block Diagram – CD Section – ....................................... 17 6-2. Block Diagram – Main Section – .................................... 18 6-3. Circuit Boards Location .................................................. 19 6-4. Schematic Diagram – Main Section (1/4) – .................... 20 6-5. Schematic Diagram – Main Section (2/4) – .................... 21 6-6. Schematic Diagram – Main Section (3/4) – .................... 22 6-7. Schematic Diagram – Main Section (4/4) – .................... 23 6-8. Printed Wiring Board – Main Section – .......................... 24 6-9. Printed Wiring Boards – TC Section – ............................ 25 6-10. Schematic Diagram – TC Section – ................................ 26 6-11. Printed Wiring Boards – Control Section – ..................... 27 6-12. Schematic Diagram – Control Section – ......................... 28 6-13. Printed Wiring Boards – Power Supply Section – ........... 29 6-14. Schematic Diagram – Power Supply Section – ............... 30 7. EXPLODED VIEWS 7-1. Rear Cabinet Section ....................................................... 38 7-2. Front Cabinet Section (1) ................................................ 39 7-3. Front Cabinet Section (2) ................................................ 40 7-4. Upper Cabinet Section (1) ............................................... 41 7-5. Upper Cabinet Section (2) ............................................... 42 7-6. CD Mechanism Section ................................................... 43 8. ELECTRICAL PARTS LIST .................................. 44 -UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.