Sony cfd f 15 cp service manual

Page 2

CFD-F15CP

CAUTION

Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haze
ardous radiation exposure.

Flexible Circuit Board Repairing

- Keep the temperature of the soldering iron around 270C during
repairing.

a Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

- Be careful not to apply force on the conductor when soldering
or unsoldering.

Notes on Chip Component Replacement

- Never reuse a disconnected chip component.

- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic
breakdown bec se of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
pans.

The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

SAFETY-RELATED COMPONENT WARNING I!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL T0 SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

LEAD FREE MARK

Unleaded solder has the following characteristics.

' Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be
applied to the solderjoint for a slightly longer time.

Soldering irons using a temperature regulator should be set to
about 350°C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip ' applied for too long, so be careful!

Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.