Sony cdx m 670 service manual

This is the 78 pages manual for sony cdx m 670 service manual.
Read or download the pdf for free. If you want to contribute, please upload pdfs to audioservicemanuals.wetransfer.com.

Page: 1 / 78
sony cdx m 670 service manual

Extracted text from sony cdx m 670 service manual (Ocr-read)


Page 1

2 optical pick-up bloc k semi-fixed resistor SERVICE NOTES SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Inputs Telephone ATT control lead Illumination control lead BUS control input connector BUS audio input connector Antenna input connector (US model) Aerial input connector (AEP, UK, E model) AUX IN connector (US model) Tone controls Bass ±8 dB at 100 Hz Treble ±8 dB at 10 Hz Loudness +8 dB at 100 Hz +2 dB at 10 Hz Power requirements 12 V DC car battery (negative earth) Dimensions Approx. 178 × 50 × 182 mm (w/h/d) Mounting dimensions Approx. 182 × 53 × 160 mm (w/h/d) Mass Approx. 1.5 kg Supplied accessories Parts for installation and connections (1 set) Front panel case (1) Card remote commander RM-X110 (US model) RM-X111 (AEP, UK, E model) NoteThis unit cannot be connected to a digital preamplifier or an equalizer. Design and specifications are subject to change without notice. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. Notes on Chip Component Replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick-up block. US model: AEP/UK model: This label is located on the bottom of the chassis. This label is located on the drive units internal chassis. When replacing the chassis (T) of mechanism deck which have the CAUTION LABEL attached, please be sure to put a new CAUTION LABEL (3-223-913-11) to the chassis (T). CDX-M620/M670

Page 2

3 stand TABLE OF CONTENTS 1. GENERAL ........................................................................... 4 2. DISASSEMBLY 2-1. Front Panel Assy (Normal) ............................................... 16 2-2. Front Panel Assy (Inoperative) ......................................... 16 2-3. CD Mechanism Block, Flexible Board ............................. 16 2-4. Sub Panel (CD) Sub Assy ................................................. 17 2-5. Motor Block Assy, Cam (R) Assy ..................................... 17 2-6. Main Board ....................................................................... 18 2-7. Heat Sink ........................................................................... 18 2-8. Chassis (T) Sub Assy ........................................................ 19 2-9. Lever Section .................................................................... 19 2-10. Servo Board ....................................................................... 20 2-11. Shaft Roller Assy ............................................................... 20 2-12. Floating Block Assy .......................................................... 21 2-13. Optical Pick-up Block ....................................................... 21 3. PHASE ALIGNMENT 3-1. Arm (A-L) Assy, Arm (B-L) Assy ..................................... 22 3-2. Cam (L) ............................................................................. 22 3-3. Motor Block ...................................................................... 23 3-4. Alignment between Arm (A-L) Assy and Arm (B-L) Assy .......................................................... 23 3-5. Arm (A-R) Assy, Arm (B-R) Assy .................................... 24 3-6. Cam (R) ............................................................................. 24 4. DIAGRAMS 4-1. IC Pin Descriptions ........................................................... 25 4-2. Circuit Boards Location .................................................... 33 4-3. Block Diagram –CD Section– ........................................... 34 4-4. Block Diagram –Tuner Section– ....................................... 35 4-5. Block Diagram –Display Section– .................................... 36 4-6. Printed Wiring Boards –CD Mechanism Section– ............ 38 4-7. Schematic Diagram –CD Mechanism Section (1/2)– ....... 40 4-8. Schematic Diagram –CD Mechanism Section (2/2)– ....... 41 4-9. Printed Wiring Boards –Main Section– ............................ 42 4-10. Schematic Diagram –Main Section (1/4)– ........................ 44 4-11. Schematic Diagram –Main Section (2/4)– ........................ 45 4-12. Schematic Diagram –Main Section (3/4)– ........................ 46 4-13. Schematic Diagram –Main Section (4/4)– ........................ 47 4-14. Printed Wiring Board –Sub (CD) Section– ....................... 48 4-15. Schematic Diagram –Sub (CD) Section– .......................... 49 4-16. Printed Wiring Board –Key Section– ................................ 50 4-17. Schematic Diagram –Key Section– .................................. 51 4-18. Printed Wiring Board –Display Section– .......................... 52 4-19. Schematic Diagram –Display Section– ............................. 53 5. EXPLODED VIEWS 5-1. Chassis Section ................................................................. 56 5-2. Cam Section ...................................................................... 57 5-3. Main Board Section .......................................................... 58 5-4. Front Panel (Key) Assy Section ........................................ 59 5-5. Front Panel (Dspl) Assy Section ....................................... 60 5-6. CD Mechanism Section (1) ............................................... 61 5-7. CD Mechanism Section (2) ............................................... 62 5-8. CD Mechanism Section (3) ............................................... 63 6. ELECTRICAL PARTS LIST ........................................ 64 NOTE FOR THE OPENING OF THE FRONT PANEL In this set, the front panel is lowered to below the bottom face when it is opened. When servicing the set, place it on a stand having a height of about 2 cm. TEST MODE 1. Turn on the power. 2. Push 4 on the card remote control for 2 sec. 3. Push 5 on the control for 2 sec. 4. Push 1 on the control for 2 sec. (The TEST MODE is entered.) 5. Push the OPEN/CLOSE switch on the control for 2 sec. 6. The front panel detouch position is set. (No display appears at this time.) 7. Turn off the power and disassemble the set. CDX-M620/M670