Sony cdx m 30 service manual
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Extracted text from sony cdx m 30 service manual (Ocr-read)
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2 CDX-M30 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT T he laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Notes on Chip Component Replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. TEST DISCS Please use the following test discs for the check on the CD section. YDES-18 (Part No. 3-702-101-01) PATD-012 (Part No. 4-225-203-01) If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick- up block. SERVICE NOTES CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Power requirements 12 V DC boat battery (negative ground (earth)) Dimensions Approx. 178 × 50 × 180 mm (7 1/8 × 2 × 7 1/8 in.) (w/h/d) Mounting dimensions Approx. 182 × 53 × 162 mm (7 1/4 × 2 1/8 × 6 1/2 in.) (w/h/d) Mass Approx. 1.2 kg (2 lb. 11 oz.) Supplied accessories Card remote commander: RM-X151 Parts for installation and connections (1 set) MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson. Design and specifications are subject to change without notice. optical pick-up semi-fixed resistor
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3 CDX-M30 -UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. - CD Playback You can play CD-DA (also containing CD TEXT) and CD-R/ CD-RW (MP3/WMA/AAC files). T ype of discs Label on the disc CD-DA MP3 WMA AAC T ABLE OF CONTENTS 1. SERVICE NOTE ........................................................ 4 2. GENERAL Location of controls and basic operations ....................... 5 Connections ..................................................................... 5 3. DISASSEMBLY 3-1. Sub (AUX) Panel Assy .................................................... 8 3 -2. CD Mechanism Block ..................................................... 8 3-3. MAIN Board .................................................................... 9 3-4. SERVO Board .................................................................. 9 3-5. Chassis (T) Sub Assy ....................................................... 10 3 -6. Roller Arm Assy .............................................................. 10 3-7. Chassis (OP) Assy ........................................................... 11 3-8. Chucking Arm Sub Assy ................................................. 11 3-9. Sled Motor Assy .............................................................. 12 3-10. Optical Pick-up Section ................................................... 13 3-11. Optical Pick-up ................................................................ 13 4. DIAGNOSIS FUNCTION ........................................ 14 5. DIAGRAMS 5-1. Block Diagram –Main Section– ...................................... 17 5-2. Block Diagram –Display Section– .................................. 18 5-3. Printed Wiring Board –Main Section– ............................ 19 5-4. Schematic Diagram –Main Section (1/3)– ...................... 20 5-5. Schematic Diagram –Main Section (2/3)– ...................... 21 5-6. Schematic Diagram –Main Section (3/3)– ...................... 22 5-7. Printed Wiring Board –Sub Section– .............................. 23 5-8. Schematic Diagram –Sub Section– ................................. 23 5-9. Printed Wiring Board –Display Section– ........................ 24 5-10. Schematic Diagram –Display Section– ........................... 25 6. EXPLODED VIEWS 6-1. Main Section .................................................................... 29 6-2. Front Panel Section ......................................................... 30 6 -3. CD Mechanism Section (MG-101FC-188//Q) ................ 31 7. ELECTRICAL PARTS LIST .................................. 32