Sony cdx gt 820 u service manual

This is the 50 pages manual for sony cdx gt 820 u service manual.
Read or download the pdf for free. If you want to contribute, please upload pdfs to audioservicemanuals.wetransfer.com.

Page: 1 / 50

Extracted text from sony cdx gt 820 u service manual (Ocr-read)

Page 1

CDX-GT828U/GT870US/GT878US 2 Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam-aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostat- ic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The ﬂ exible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re ﬂ ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. SERVICE NOTES CAUTION Use of controls or adjustments or performance of procedures other than those speci ﬁ ed herein may result in hazardous radiation exposure. If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi- ﬁ xed resistor located at the side of optical pick-up block. TEST DISCS Please use the following test discs for the check on the CD section. YDES-18 (Part No. 3-702-101-01) PATD-012 (Part No. 4-225-203-01) USB Player section Interface: USB (Full-speed) Maximum current: 500mA Power ampliﬁ er sectionOutputs: Speaker outputs (sure seal connectors) Speaker impedance: 4 – 8 ohms Maximum power output: 52 W × 4 (at 4 ohms) GeneralOutput: Audio outputs terminal (front/rear) Subwoofer output terminal (mono) Power antenna (aerial) relay control terminal Power ampliﬁ er control terminal Inputs: Telephone ATT control terminal Illumination control terminal Bus control input terminal Bus audio input terminal Remote controller input terminal Antenna (aerial) input terminal AUX input jack (stereo mini jack) USB signal input terminal Tone controls: Low: ±10 dB at 60 Hz (XPLOD) Mid: ±10 dB at 1 kHz (XPLOD) High: ±10 dB at 10 kHz (XPLOD) Power requirements: 12 V DC car battery (negative ground (earth)) Dimensions: Approx. 178 × 50 × 180 mm (w/h/d) Mounting dimensions: Approx. 182 × 53 × 162 mm (w/h/d) Mass: Approx. 1.2 kg Supplied accessories: Card remote commander: RM-X154 (CDX-GT828U) RM-X156 (CDX-GT870US/GT878US) Parts for installation and connections (1 set) US and foreign patents licensed from Dolby Laboratories. MPEG Layer-3 audio coding technology and patents licensed from Fraun- hofer IIS and Thomson. This product is protected by certain intellectual property rights of Mic\ ro- soft Corporation. Use or distribution of such technology outside of this\ product is prohibited without a license from Microsoft or an authorized \ Microsoft subsidiary. Design and speciﬁ cations are subject to change without notice. SAFETY-RELATED COMPONET WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. optical pick-up semi-fixed resistor

Page 2

CDX-GT828U/GT870US/GT878US 3 - CD playbackYou can play CD-DA (also containing CD TEXT), CD-R/CD- RW (MP3/WMA/AAC ﬁ les). Type of discs Label on the disc CD-DA MP3 WMA AAC 1. SERVICE NOTE ..................................................... 4 2. GENERAL Location of Controls ....................................................... 5 Connections .................................................................... 6 3. DISASSEMBLY 3-1. Sub Panel Assy ............................................................... 9 3-2. CD Mechanism Block ..................................................... 9 3-3. Main Board ..................................................................... 10 3-4. Servo Board .................................................................... 10 3-5. Chassis (T) Sub Assy ...................................................... 11 3-6. Roller Arm Assy .............................................................. 11 3-7. Chassis (OP) Assy ........................................................... 12 3-8. Chucking Arm Sub Assy ................................................. 12 3-9. Sled Motor Assy .............................................................. 13 3-10. Optical Pick-up Section .................................................. 14 3-11. Optical Pick-up ............................................................... 14 4. DIAGNOSIS FUNCTION ..................................... 15 5. DIAGRAMS 5-1. Block Diagram –Main Section– ..................................... 19 5-2. Block Diagram –Display Section– ................................. 20 5-3. Printed Wiring Board –Main Section (1/2)– ................... 22 5-4. Printed Wiring Board –Main Section (2/2)– ................... 23 5-5. Schematic Diagram –Main Section (1/4)– ...................... 24 5-6. Schematic Diagram –Main Section (2/4)– ...................... 25 5-7. Schematic Diagram –Main Section (3/4)– ...................... 26 5-8. Schematic Diagram –Main Section (4/4)– ...................... 27 5-9. Printed Wiring Board –Sub Section- .............................. 28 5-10. Schematic Diagram –Sub Section- ................................. 29 5-11. Printed Wiring Boards –Key Section – ........................... 30 5-12. Schematic Diagram –Key Section – ............................... 31 6. EXPLODED VIEWS 6-1. Main Section ................................................................... 38 6-2. Front Panel Section ......................................................... 39 6-3. CD Mechanism Section (MG-101I-188//Q) ................... 40 7. ELECTRICAL PARTS LIST .............................. 41 TABLE OF CONTENTS UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to ﬂ ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. This compact disc player is classi ﬁ ed as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the exterior. This label is located on the bottom of the chassis.