Sony cdx gt 272 service manual
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Page 1
CDX-GT272 2 UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostat- ic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fl exible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re fl ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. This compact disc player is classi fi ed as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the exterior. This label is located on the bottom of the chassis. - CD playback You can play CD-DA (also containing CD TEXT), CD-R/CD- RW (MP3/WMA fi les). Type of discs Label on the disc CD-DA MP3 WMA CAUTION Use of controls or adjustments or performance of procedures other than those speci fi ed herein may result in hazardous radiation exposure. If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi- fi xed resistor located at the side of optical pick-up block. TEST DISCS Please use the following test discs for the check on the CD section. YDES-18 (Part No. 3-702-101-01) PATD-012 (Part No. 4-225-203-01) SAFETY-RELATED COMPONET WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. optical pick-up semi-fixed resistor
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CDX-GT272 3 SECTION 1 SERVICE NOTE EXTENSION CABLE AND SERVICE POSITION When repairing or servicing this set, connect the jig (extension cable) as shown below. - Connect the MAIN board (CNP301) and the SERVO board (CN2) with the extension cable (Part No. J-2502-076-1). SERVO BOARD CN2 MAIN BOARD CNP301 J-2502-076-1 1. SERVICE NOTE ..................................................... 3 2. GENERAL Location of Controls ....................................................... 5 Connections .................................................................... 5 3. DISASSEMBLY 3-1. Sub Panel Assy ............................................................... 8 3-2. CD Mechanism Block ..................................................... 8 3-3. Main Board ..................................................................... 9 3-4. Servo Board .................................................................... 9 3-5. Chassis (T) Sub Assy ...................................................... 10 3-6. Roller Arm Assy .............................................................. 10 3-7. Chassis (OP) Assy ........................................................... 11 3-8. Chucking Arm Sub Assy ................................................. 11 3-9. Sled Motor Assy .............................................................. 12 3-10. Optical Pick-up Section .................................................. 13 3-11. Optical Pick-up ............................................................... 13 4. DIAGNOSIS FUNCTION ..................................... 14TABLE OF CONTENTS 5. DIAGRAMS 5-1. Block Diagram –Main Section– ..................................... 17 5-2. Block Diagram –Display Section– ................................. 18 5-3. Printed Wiring Board –Main Section– ............................ 19 5-4. Schematic Diagram –Main Section (1/4)– ...................... 20 5-5. Schematic Diagram –Main Section (2/4)– ...................... 21 5-6. Schematic Diagram –Main Section (3/4)– ...................... 22 5-7. Schematic Diagram –Main Section (4/4)– ...................... 23 5-8. Printed Wiring Boards –Key Section– ............................ 24 5-9. Schematic Diagram –Key Section– ................................ 25 6. EXPLODED VIEWS 6-1. Main Section ................................................................... 29 6-2. Front Panel Section ......................................................... 30 6-3. CD Mechanism Section (MG-101TC-188//C) ............... 31 7. ELECTRICAL PARTS LIST .............................. 32