Sony cdx 5100 service manual

Page 2

TABLE OF CONTENTS

mm

M

Specifications ,.
Servicing Notes

1. GENERAL
Location of Controls
Installation ............

Connections .................................................................

2. DISASSEMBLY

3. TEST MODE .................

4. ELECTRICAL ADJUSTMENTS
Tuner Section
CD Section

5. DIAGRAMS

5-1 . Printed Wiring Boards
- Mechanism Deck Section - .........................................
5-2. Schematic Diagram
- Mechanism Deck Section -
5-3. Schematic Diagram - Main Section -
5-4. Printed Wiring Board - Main Section -
5-5. Printed Wiring Board - Display Section -
5-6. Schematic Diagram - Display Section
5-7, IC Pin Function Description ...................

6. EXPLODED VIEWS ........................

7. ELECTRICAL PARTS LIST

SAFETY-RELATED COMPONENT WARNINGII

COMPONENTS IDENTIFIED BV MARK A OR DOTTED
LINE Wfl'H MARK A. ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

l4

29

III

.33

SERVICING NOTES

Laser Diode Properites

' Material: GaAlAs

- Wavelength: 780nm

- Emission Duration: continuous

- Laser Output Power: less than 44.6 uW

* This output is the value measured at a distance of 200

mm from the objective lens surface on the Optical Pick-
up Block.

CAUTION

Use of controls or adjustments or performance of pro-
cedures other than those specified herein may result in
hazardous radiation exposure.

NOTES ON HANDLING THE OPTICAL
PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer elec-
trostatic breakdown because of the potential difference gen-
erated by the charged electrostatic load, etc. on clothing and
the human body.

During repair. pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is included
in the repair parts.

The flexible board is easily damaged and should be handled
with care.

Flexible Circuit Board Repairing

- Keep the temperature of the soldering iron around 270 'C
during repairing.

0 Do not touch the soldering iron on the same conductor of
the circuit board (within 3 times).

0 Be careful not to apply force on the conductor when solder-
ing or unsoldering,

Notes on chip component replacement

o Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may be
damaged by heat.

ATTENTION AU COMPOSANT AYANT RAPPORT
A LA SECURITEI

LES COMPOSANTS IDENTIFIES PAR UNE MAROUE A
sun LES DIAGRAMMES SCHEMATIOUES ET LA LISTE
DES PIECES SONI CRITIQUES POUR LA SECURITE
DE FONCTIOMNEMENT. NE REMPLACER ces com-
POSANTS QUE PAR DES PIECES SONY DONT LES
NuMEnos SONT DONNES DANS cE MANUEL ou DANS
LES SUPPLEMENTS PUBLIEs PAR SONV.