Sony cdx 51 service manual

Page 1

CDX-51/51RF

|JIANUAI.

US Model

Canadian

Model

AEP Model

E Model
UK Model

Model Name Using Similar Mechanism

CDX<45I45RF

Optical Pick-Up Block Name

KSS-41 0A

SPECIFICATIONS

5c digital audio

rAs
.l min
.jontinuous
:r Less than 44.6 uW*

* This output is the value
measured at a distance of 200
mm from the objective lens
surface on the Optical Pick-

up Block.
icy response 10 - 20,000 Hz
and flutter Less than measurable limit
flaI'tO-I'IOISE ratio More than 90 dB

lutput terminals BUS control output terminal
(8 pin)
Analog audio output terminal
(RCA pin)

Current drain 800 mA (at playback)
800 mA (at disc Ioading/
ejecting)

Operational temperature
~10C to +55°C(14°F7131°F)

Dimensions Approx. 305 x 90 x 180 mm
(12% x 35/: x 7 /F in.) (w/h/
d)

Mass Approx 22 kg (4 lb, 13 oz.)

Hideaway unit/Remote commander
(cox-51m= ONLY)

Frequency 83.3 MHz/88.7 MHz/
897 MHz/89.9 MI'IZ
(switchable)
Dimensions Hideaway unit:
Approx. 1E2 x 316 x1282 mm
(5 x1'/: X5/nin.)(W/11/d)
Remote commander:
Approx. 148 x 30 x 15 mm
(57/: x Flux /12 in.) (w/h/d)
Mass Hideaway unit:
Approx. 450 g (16 oz.)
Remote commander:
Approx. 120 g (4 oz.)
Supplied accessories
Disc magazine (1)
BUS cable (I)
RCA pin cord (1)

Mounting hardware (1 set)

Design and specifications subject to change without
notice,

CDX-51

COMPACT DISC CHANGER

CDX-51RF

COMPACT DISC CHANGER SYSTEM

MICROFILM

ONE

Page 2

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer
electrostatic breakdown because of the potential difference
generated by the charged electrostatic load, etc. on clothing
and the human body.

During repair, pay attention to electrostatic breakdown and
also use the procedure in the printed matter which is
included in the repair pans.

The flexible board is easily damaged and should be handled
with care.

ser Diode Properties
Material: GaAlAs
Wavelength: 780 nm
Emission Duration: continuous
ser Output Power. less than 44.6 n W*
his output is the value measured at a distance of
mm from the objective lens surfase on the
al Pick-up Block.

or adjustments or performance
er than those specified herein
Nous radistion exposure.

SAFETY-RE LATED COMPONENT WARNINGII

COMPONENTS IDENTIFIED BY MARK A OR DOTI'ED
LINE WITH MARK A ON THE SCHEMA11C DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

ATrENTION AU COMPQSANT AVANT RAPPORT
A LA SECURITEI

LES COMPOSANTS IDEN11FIES PAR UNE MAROUE A
sun Les DIAGRAMMES SCHEMATIOUES ET LA LISTE
DES PIECES SONT CRITIQUES POUR LA sEcURITE
DE FONCTIONNEMENT. NE REMPLAcER CES com-
POSANTS QUE PAR DES PIECES SONY DONT LES
NuMéRos SONT DoNNES DANS CE MANUEL ou
DANS LES SUPPLEMENTS PUBLIE'S PAR SONY.

TABLE OF CONTENTS

Section Title Page
Specifications ............................... 1

Notes on Handling the Optical Pick-up Block

or Base Unit 2
Servicing Note ----- 2
1. GENERAL

Installation 3

Connections - 5

Location and Function of Controls ----------- 6
2_ DISASSEMBLV ......................... 7

MECHANICAL ADJUSTMENTS
3-1. Elevator Height Adjustment ---------------- 10
4. ELECTRICAL ADJUSTMENTS
4-1. Focus Offset Adjustment ------------------- 11
4-2. Tracking Offset Adjustment ---------------- 11
4-3. DC Balance Adjustment ------------------- 12
5. DIAGRAMS
5-1 Compact Disc Changer Section

Block Diagram ........................... 13
5-2. Hideaway Section Block Diagram ----------- 15
5-3. Compact Disc Changer Section

Printed Wiring Boards ..................... 20
5-4. Compact Disc Changer Section

Schematic Diagram .................... . . . 23
5-5. Hideaway Section Printed Wiring Board ------ 30
5-6. Hideaway Section Schematic Diagram ------- 31
5-7. 1C Pin Function Description ---------------- 33
6. EXPLODED VIEWS -------------------- 38
7. ELECTRICAL PARTS LIST ------------ 4s

SERVICING NOTE

Flexlble Clrcult Board Repalrlng

0 Keep the temperature of the soldering iron around
270°C during repairing.

0 Do not touch the soldering iron on the same conductor
of the circuit board (within 3 times).

0 Be careful not to apply force on the conductor when
soldering or unsoldering.

Notes on chip component replacement

0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may
be damaged by heat.