Sony cdx 3183 service manual
This is the 44 pages manual for sony cdx 3183 service manual.
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Extracted text from sony cdx 3183 service manual (Ocr-read)
Page 1
Ð 2 Ð TABLE OF CONTENTS 1. GENERAL A kŽszŸlŽk kezelýogombjai ....................................................... 3 Elsýo lŽpŽsek ............................................................................. 3 îra be‡llt‡sa ........................................................................... 4 CD lej‡tsz- .............................................................................. 4 R‡di- ....................................................................................... 4 EgyŽb funkci-k ........................................................................ 5 Csatlakoz‡sok .......................................................................... 7 2. DISASSEMBLY 2-1. Cover Assy .......................................................................... 9 2-2. Front Panel Assy ................................................................. 9 2-3. Sub Panel (1) Assy ............................................................ 10 2-4. CD Mechanism Block ....................................................... 10 2-5. Main Board ....................................................................... 11 2-6. Heat Sink ........................................................................... 11 2-7. Chassis (T) Sub Assy ........................................................ 12 2-8. Lever Assy ......................................................................... 12 2-9. Servo Board ....................................................................... 13 2-10. Roller Assy ........................................................................ 13 2-11. Chassis (OP) (O/S) Assy ................................................... 14 2-12. Optical Pick-up Block ....................................................... 14 3. ELECTRICAL ADJUSTMENTS Tuner Section ......................................................................... 15 CD Section ............................................................................ 18 4. DIAGRAMS 4-1. IC Pin Description ............................................................. 19 4-2. Circuit Boards Location .................................................... 21 4-3. Printed Wiring Boards ÐCD Mechanism SectionÐ ............ 23 4-4. Schematic Diagram ÐCD Mechanism SectionÐ ................ 25 4-5. Printed Wiring Board ÐDisplay SectionÐ .......................... 27 4-6. Schematic Diagram ÐDisplay SectionÐ ............................. 29 4-7. Printed Wiring Board ÐMain SectionÐ .............................. 31 4-8. Schematic Diagram ÐMain Section (1/2)Ð ........................ 33 4-9. Schematic Diagram ÐMain Section (2/2)Ð ........................ 35 5. EXPLODED VIEWS 5-1. Chassis Section ................................................................. 40 5-2. Front Panel Section ........................................................... 41 5-3. CD Mechanism Section (1) ............................................... 42 5-4. CD Mechanism Section (2) ............................................... 43 5-5. CD Mechanism Section (3) ............................................... 44 6. ELECTRICAL PARTS LIST ........................................ 45 SERVICE NOTE CAUTION Use of controls or adjustments or performance of proce- dures other than those specified herein may result in haz- ardous radiation exposure. Notes on Chip Component Replacement ·Never reuse a disconnected chip component. ·Notice that the minus side of a tantalum capacitor may be dam- aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. NOTES ON PICK-UP FLEXIBLE BOARD The pick-up flexible board in this set is secured to the optical pick-up with an adhesive tape. Once the tape is removed, an adhering force becomes weak, and it cannot be reused. Therefore, if the optical pick-up is replaced, replace also the pick-up flexible board with a new one. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.