Sony cdp xb 740 service manual
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Extracted text from sony cdp xb 740 service manual (Ocr-read)
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2 SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. PARTS No. MODEL MODEL IDENTIFICATION - BACK PANEL - TABLE OF CONTENTS 1. SERVICING NOTE .......................................................... 3 2. GENERAL .......................................................................... 6 3. DISASSEMBLY 3-1. Front Panel ........................................................................... 7 3-2. Base Unit (BU-5BD25) ......................................................... 7 4. TEST MODE ....................................................................... 8 5. ELECTRICAL BLOCK CHECKING ........................ 10 6. DIAGRAMS 6-1. Circuit Boards Location ...................................................... 12 6-2. Printed Wiring Board – BD Section – ................................. 14 6-3. Schematic Diagram – BD Section – ................................... 15 6-4. Printed Wiring Board – Main Section – .............................. 16 6-5. Schematic Diagram – Main Section – ................................ 17 6-6. Printed Wiring Board – Display Section – .......................... 18 6-7. Schematic Diagram – Display Section – ............................ 19 6-8. Schematic Diagram – Power/HP Section – ........................ 20 6-9. Printed Wiring Board – Power/HP Section – ...................... 20 6-10. Schematic Diagram – Loading Motor Section – ............... 21 6-11. Printed Wiring Board – Loading Motor Section – ............ 21 6-12. IC Pin Functions ................................................................ 22 6-13. IC Block Diagrams ............................................................ 26 7. EXPLODED VIEWS 7-1. Case Section ........................................................................ 29 7-2. Front Panel Section ............................................................. 30 7-3. Mechanism Deck Section (CDM14FLS-5BD25) ............... 31 7-4. Base Unit Section (BU-5BD25) .......................................... 32 8. ELECTRICAL PARTS LIST ........................................ 33 4-997-214-6s 4-997-214-7s XB740 XB740E Parts No.
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3 SECTION 1 SERVICING NOTE HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH TURNS OFF Insert a tapering driver into the aperture of the unit bottom, and turn in the direction of arrow. *To close the disc table, turn the driver in the reverse direction. Pull out disc table. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the S curve check in CD section adjustment and check that the S curve waveform is output continuously.