Sony cdp h 7900 service manual

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sony cdp h 7900 service manual

Extracted text from sony cdp h 7900 service manual (Ocr-read)


Page 1

EDP-H7900

SERVICE MANUAL us Model

Canadian Model
AEP Model

UK Model

E Model
Australian Model
Tourist Model

CDP»H7900 is the COMPACT DISC
PLAYER section in MHC-7900/ P100X

Model Name Using Similer Mechanism NEW
CD Mechanism Type CDMMM-SBDIO
Base Unit Type BU-SBD1OB
Optical Pick-up Type KSS-240A
SPECIFICATIONS
Outputs
System Compact disc digital LINE OUT (phono jacks):
audio system Output level 2. V
Laser Semiconductor laser (at 50 kilohms)
Wavelength 780 - 790 nm Load impedance over
Frequence response 2 Hz -- 20 kHz 10 kilohms
(i05 dB) DIGITAL OPTICAL OUT
Signal-to-noise ratio (Square optical connector jack, rear
More than 115 dB panel):
Dynamic range wave length 660 nm
More than 100 dB output level -18 dBm
Harmonic distortion OPTICAL CD DIGITAL OUT
Less than 0003% (Optical mini jack, front panel):
Channel separation More than 110 dB wave length 660 nm
output level -18 dBm
Dimensions

Approx, 225 x 85 x 230 mm (w/h/d)
(8 7/8 x 3 3/8 x 9 1/8 inches)
Mass Approx. 2.0 kg
(4 lb 0 oz)

COMPACT msc PLAYER
S ONY;

Page 2

TABLE OF CONTENTS


.S_e_c.ti_o_I1 mic Ease
Laser component in this product is capable of emitting radiation
exceeding the limit for Class I, 1 . SERVICING NOTE ................................................. 3
2. GENERAL
This appliance is classified as 3 Index to Parts and Controls ........................................................ 4
CLASS 1 LASER pnooucf CLASS 1 LASER product, The
LUOKAN 1 LASERLAIIE CLASS 1 LASER PRODUCT 3. DISASSEMBLY
KLASSI LASERAPPARAT MARKING is located on the 3.1, Front Panel _ ' 5
rear exterior. 3-2. Back Pane ' 5
3-3. Power Board . 6
3-4. CD Mechanism Deck . 6
This caution
W W1 is 1°C? 4. TEST MODE ........................................................... 7
ADVARSELZ usgcmuue LASEHSTRALIN NG vsn Aauma MAR InSIde the unit.
use. ESEErEIEfiE'é 5.3m"
no; 'AVAHAESSAJ JAS suouwm'us mrErrAEssA 5. ELECTRICAL BLOCK CHECKING ........................ 9

'DIET ALTnmA LASERSATEILVLLE

___T_um______r
W 6. DIAGRAMS

ADVAHSEL' SI." Gafifiififiééw MEI "5 6-1. Circuit Boards Location ...................
6-2. Block Diagram ..........

5-3. Primed Wiring Boards.


6»4. Schematic Diagram ............
6-5. Semiconductor Lead Layouts
6-6. IC Pin Functions

. ICIO1 (CXD25150) ........................................................ 22
~ |0301 CD Mechanism Controller, FL Driver
(CXP82316-04OQ) .......................................................... 25

7. EXPLODED VIEWS


Notes on chip component replacement 7-1. Case and Chassis Block .
- Neverreuseadisconnectedchipcomponent. 7-2. Mechanism Deck Block" 7
o Notice that the minus side of a tantalum capacitor may be 73' Optical P'Ck'uP BIOCK (BU5BDIOB
dama edb heat.
3 y 8. ELECTRICAL PARTS LIST ................................... 29
SAFETY- RELATED COMPONENT WARNINGII ATTENTION AU COMPOSANT AVANT RAPPORT
COMPONENTS IDENTIFIED BY MARK A OR DOTTED A LA SECUR'TE!
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMs LES COMPOSANTS IDENTIFIES PAR UNE MAROUE A
AND IN THE PARTS LIST ARE CRITICAL TO SAFE SUR LES DIAGRAMMES SCHEMATIQUES ET LA LISTE
OPERATION. REPLACE THESE COMPONENTS WITH DES PIECES SONT CRITIQUES POUR LA SECURITE
soNY PARTS WHOSE PART NUMBERS APPEAR As DE FONCTIONNEMENT. NE REMPLACER CES COM-
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- POSANTS QUE PAR DES PIECES SONY DONT LES
LISHED BY SONY. NUMEROS SONT DONNES DANS CE MANUEL 0U

DANS LES SUPPLEMENTS PUBLIES PAR SONY.