Sony cdp h 7700 d service manual

Page 1

CDP-HTIUUD

SERVIcfiiANUAL WM

To urist Model

This set is the CD player section

in FH-E959.
Model Name Using Similar Mechanism CDP-H3700
CD Mechanism Type CDMlBBA-SBD3
Optical Pickap Block Type BU-SBD3
SPECIFICATIONS
System Compact disc digital audio
syslem
Laser Semiconduclor laser
(2 = 780 nm)
Emission duration:
contlnuous
Laser output Max, 44.6 uW

' This output Is the value
measured at a distance ol
about 200 mm lrom the
objective lens surface on
the Oplical Pickup Block.

Deslgn and speclllcatlons subject to change
wilhdul notice.

SAFETY-RELATED COMPONENT WARNING

COMPONENTS IDENTlFlED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

COMPACT DISC PLAYER

SONY;

Page 2

CDP-H77OOD

TABLE OF °°NTENTS NOTES ON HANDLING THE OPTICAL PICK-UP

BLOCK OR BASE UNIT

Section Lfle fig
1. GENERAL The laser diode in the optical pick-up block may suffer
1.1. Parts Identification ............................ 3 electrostatic breakdown because of the potential diference
generated by the charged electrostatic load, etc. on clothing
2. TEST MODES and the human body.
21. Test Mode of Display Microcomputer (IC401) . . . .4 During repair, pay attention to electrostatic breakdown and
2-2. Test Mode of CD System Controller (ICZOZ) ...... 4 also use the procedure in the printed matter which is included
in the repair parts.
3. ELECTRICAL BLOCK CHECKING ................ 5 The flexible board is easily damaged and should be handled
with care.

4. DIAGRAMS
4-1. Pin Description ................................ 7 NOTES ON LASER DIODE EMISSION CHECK
4-2. Block Diagram ............... The laser beam on this model is concentrated so as to be
43. Printed Wiring Boards 44444444 focused on the disc reflective surface by the objective lens in
4~4. Schematic Diagram ............ the optical pick-up block. Therefore, when checking the laser
4-5. Semiconductor Lead Layouts .................. 22 diode emission, observe from more than 30cm away from the
objective lens.

5. EXPLODED VIEWS

5-1. Chassis ...................................... 23 LASER DIODE AND FOCUS SERCH OPERATION CHECK
5-2. CD Block (CDM13BA-SBD3) .................. 24 1. Make POWER switch on with no disc inserted and disc
5-3. Optical Pick-Up Block (BU-SBDS) .............. 25 table closed.
2. Confirm that the following operation is performed while
6. ELECTRICAL PARTS LIST ...................... 26 observing the objective lens.

6

O

0Confirm that laser beam is spread.
0 Up and down motion of the objective lens. (3 times)