Sony cdp ca 80 es service manual
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Ñ 2 Ñ 1. GENERAL ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááááááááááááá 7 2. DISASSEMBLY 2-1. Front Panel ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááááááá 11 2-2. Disc Table Assy ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááááááá 11 2-3. Back Panel and Disc Table ááááááááááááááááááááááááááááááááááááááááááááááá 12 2-4. Optical Pick-up Block Assembly ááááááááááááááááááááááááááááááááááááá 12 2-5. Bracket (Gear) Assembly ááááááááááááááááááááááááááááááááááááááááááááááááá 13 3. TEST MODE ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááááááá 14 4. ELECTRICAL BLOCK CHECKING áááááááááááááááááááá 17 5. DIAGRAMS 5-1. Circuit Boards Location ááááááááááááááááááááááááááááááááááááááááááááááááááá\ 19 5-2. Block Diagram ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááá 21 5-3. Schematic Diagram Ñ BD Section Ñ ááááááááááááááááááááááááááááá 23 5-4. Printed Wiring Board Ñ BD Section Ñ áááááááááááááááááááááááááá 25 5-5. Printed Wiring Board Ñ Main Section Ñ ááááááááááááááááááááááá 27 5-6. Schematic Diagram Ñ Main Section (1/2)Ñ áááááááááááááááááá 29 5-7. Schematic Diagram Ñ Main Section (2/2)Ñ áááááááááááááááááá 31 5-8. Schematic Diagram Ñ HP/Function Section Ñ áááááááááááááá 33 5-9. Printed Wiring Board Ñ HP/Function Section Ñ ááááááááááá 34 5-10. Schematic Diagram Ñ Display Section Ñ áááááááááááááááááááááá 35 5-11. Printed Wiring Board Ñ Display Section Ñ ááááááááááááááááááá 37 5-12. IC Block Diagrams ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááá 39 5-13. IC Pin Functions ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááá 42 6. EXPLODED VIEWS 6-1. Front Panel and Case Section ááááááááááááááááááááááááááááááááááááááááááá 46 6-2. Back Panel and Disc Table Section áááááááááááááááááááááááááááááááááá 47 6-3. Chassis Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááá 48 6-4. Base Unit Section (BU-5BD22) ááááááááááááááááááááááááááááááááááááááá 49 7. ELECTRICAL PARTS LIST ááááááááááááááááááááááááááááááááááá 50 TABLE OF CONTENTS PARTS No. MODEL MODEL IDENTIFICATION Ñ BACK PANEL Ñ 4-998-478-0¹ 4-998-478-2¹ 4-998-478-4¹ 4-998-478-5¹ US E SP AEP yyyyyyyy PART NO.
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Ñ 3 Ñ SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, ÒmetallizedÓ knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturersÕ instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The ÒlimitÓ indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) SAFETY CHECK-OUT To Exposed Metal Parts on Set 0.15 µF 1.5 k ½ AC Voltmeter (0.75 V) Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. The following caution label is located inside of the unit.