Sony cdc z 137 service manual
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Extracted text from sony cdc z 137 service manual (Ocr-read)
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2 CDC-Z137 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE P ART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. A TTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. GENERAL Po wer-Supply Voltage: 14.4 V (11 to 16 V allowable), DC, negative ground Load Impedance: 4 Ω T one Control: Bass ±10 dB at 100 Hz, Treble ±10 dB at 10 kHz Preamp Output Voltage (load impedance): 2.2 V (10 k Ω) Installed size: 182 (W) × 53 (H) × 155 (D) mm (7 1/4 (W) × 2 1/8 (H) × 6 1/8 (D) inches) - Specifications and external appearance are subject to change without notice due to product improvement. SERVICE NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. Notes on Chip Component Replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
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3 TABLE OF CONTENTS 1. GENERAL Connections ............................................................................. 4 2. DISASSEMBLY 2-1. Front Panel Assy ................................................................. 6 2-2. CD Mechanism Block ......................................................... 6 2-3. Cover ................................................................................... 7 2-4. Key Board ........................................................................... 7 2-5. Aux Board ........................................................................... 8 2-6. Removal The Solders .......................................................... 8 2-7. Main Board ......................................................................... 9 2-8. Heat Sink ............................................................................. 9 2-9. Sub Board .......................................................................... 10 2-10. Servo Board ....................................................................... 10 2-11. Floating Block Assy .......................................................... 11 2-12. Lever Assy (CD Up Holder) .............................................. 11 2-13. Lever (CD Roller) Sub Assy ............................................. 12 2-14. Lever Assy (CD Holder) ................................................... 12 2-15. Motor (Sled) Sub Assy ...................................................... 13 2-16. Pick-up Sub Assy .............................................................. 13 3. DIAGRAMS 3-1. IC Pin Descriptions ........................................................... 15 3-2. Block Diagram –CD Section– ........................................... 19 3-3. Block Diagram –Main Section– ........................................ 20 3-4. Block Diagram –Front Section– ........................................ 21 3-5. Circuit Boards Location .................................................... 21 3-6. Printed Wiring Boards –CD Mechanism Section– ............ 22 3-7. Schematic Diagram –CD Mechanism Section– ................ 24 3-8. Printed Wiring Boards –Main Section– ............................ 25 3-9. Schematic Diagram –Main Section (1/2)– ........................ 26 3-10. Schematic Diagram –Main Section (2/2)– ........................ 27 3-11. Printed Wiring Board –Front Section– .............................. 28 3-12. Schematic Diagram –Front Section– ................................ 29 3-13. IC Block Diagrams ............................................................ 30 4. EXPLODED VIEWS 4-1. Chassis Section ................................................................. 32 4-2. Front panel Section ........................................................... 33 4-3. CD Mechanism Section (1) ............................................... 34 4-4. CD Mechanism Section (2) ............................................... 35 5. ELECTRICAL PARTS LIST ........................................ 36 CDC-Z137