Sony cdc r 30 mp service manual
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2 CDC-R30MP/X30MP SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. GENERAL Power-Supply Voltage: 14.4 V (11 to 16 V allowable), DC, negative ground Load Impedance: 4 Ω Tone Control: Bass ±10 dB at 100 Hz, Treble ±10 dB at 10 kHz Preamp Output Voltage (load impedance): 2.2 V (10 kΩ) Installed size: 182 (W) × 53 (H) × 155 (D) mm (7 1/4 (W) × 2 1/8 (H) × 6 1/8 (D) inches) Supplied Accessory: Carrying case (1) CARD REMOTE CONTROLDimensions: Approx. 33 (W) × 85 (H) × 7.5 (D) mm (1 5/16 (W) × 3 3/8 (H) × 5/16 (D) inches) Weight: Approx. 20 g (0.7 oz.) (including battery) - Specifications and external appearance are subject to change without notice due to product improvement. SERVICE NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. Notes on Chip Component Replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat.CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. This compact disc player is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the exterior. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. CDC-X30MP: CDC-R30MP: ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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3 TABLE OF CONTENTS 1. GENERAL Connections (CDC-X30MP) ................................................... 4 Connections (CDC-R30MP) ................................................... 5 2. DISASSEMBLY 2-1. Sub Panel Assy .................................................................... 8 2-2. CD Mechanism Block ......................................................... 8 2-3. Main Board Section ............................................................ 9 2-4. Main Board ......................................................................... 9 2-5. Heat Sink (CT) .................................................................. 10 2-6. Sub Board .......................................................................... 10 2-7. Servo Board ....................................................................... 11 2-8. Floating Block Assy .......................................................... 11 2-9. Lever Assy (CD Up Holder CNF) ..................................... 12 2-10. Lever (CD Roller) Sub Assy ............................................. 12 2-11. Lever Assy (CD Holder) ................................................... 13 2-12. Motor (Sled) Sub Assy ...................................................... 13 2-13. Pick-up Sub Assy .............................................................. 14 3. ELECTRICAL ADJUSTMENT .................................... 15 4. DIAGRAMS 4-1. IC Pin Descriptions ........................................................... 16 4-2. Block Diagram –CD Section– ........................................... 23 4-3. Block Diagram –Main Section– ........................................ 24 4-4. Block Diagram –Front Section– ........................................ 25 4-5. Circuit Boards Location .................................................... 25 4-6. Printed Wiring Boards –CD Mechanism Section– ............ 26 4-7. Schematic Diagram –CD Mechanism Section (1/2)– ....... 28 4-8. Schematic Diagram –CD Mechanism Section (2/2)– ....... 29 4-9. Printed Wiring Board –Main Section– .............................. 30 4-10. Schematic Diagram –Main Section (1/2)– ........................ 31 4-11. Schematic Diagram –Main Section (2/2)– ........................ 32 4-12. Printed Wiring Boards –Front Section– ............................ 33 4-13. Schematic Diagram –Front Section– ................................ 34 4-14. IC Block Diagrams ............................................................ 35 5. EXPLODED VIEWS 5-1. Chassis Section ................................................................. 38 5-2. Front panel Section ........................................................... 39 5-3. CD Mechanism Section (1) ............................................... 40 5-4. CD Mechanism Section (2) ............................................... 41 6. ELECTRICAL PARTS LIST ........................................ 42 CDC-R30MP/X30MP