Sony bdp s 500 service manual
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Extracted text from sony bdp s 500 service manual (Ocr-read)
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– 2 – WARNING!! WHEN SERVICING, DO NOT APPROACH THE LASER EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO CONFIRM LASER BEAM EMISSION, BE SURE TO OBSERVE FROM A DISTANCE OF MORE THAN 25 cm FROM THE SURFACE OF THE OBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Fig. A. Using an AC voltmeter to check AC leakage. 1.5 k Ω 0.15 µF AC voltmeter (0.75 V) To Exposed Metal Parts on Set Earth Ground LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 mi- croamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers' instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indica- tion is 0.75V, so analog meters must have an accurate low- v oltage scale. The Simpson 250 and Sanwa SH-63Trd are ex- amples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suit- ab le. (See Fig. A) 1. Check the area of your repair for unsoldered or poorly-sol- dered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are pinched or contact high-wattage resistors. 3. Look for unauthorized replacement parts, particularly transis- tors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recom- mend their replacement. 5. Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer. 6. Check the B+ voltage to see it is at the values specified. 7. Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer: CAUTION: The use of optical instrument with this product will increase eye hazard. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. This label is located on the laser protective housing inside the enclosure. This appliance is classified as a CLASS1 LASER product. The CLASS1 LASER PRODUCT MARKING is located on the laser protective housing inside the enclosure.
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– 3 – T ABLE OF CONTENTS Section Title Page Section Title Page SERVICE NOTE 1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION) .......... 4 2. TEST DISC .................................................................... 4 3. POSITION OF COUNTERMEASURE PA RTS............ 17 1. GENERAL Getting Started .............................................................. 1-2 Basic Operations ........................................................... 1-5 W atching Movie Files .................................................... 1-8 Listening to Music Files ................................................. 1-9 Viewing Photo Files ....................................................... 1-10 Changing the Initial Settings ......................................... 1-11 Additional Information ................................................... 1-13 2. DISASSEMBLY AND REASSEMBLY 2-1. Disassembly Flow ......................................................... 2-1 2-2. Upper Case ................................................................... 2-1 2-3. Front Display Block Assy ...............................................2-2 2-4. Tray Cov er Assy............................................................ 2-2 2-5. BD Drive (Service Use)................................................. 2-3 2-6. MAIN Board ................................................................... 2-3 2-7. AU-258 Board................................................................ 2-4 2-8. Power Block................................................................... 2-4 2-9. Circuit Boards Location ................................................. 2-5 3. BLOCK DIAGRAMS 3-1. Main Block Diagram...................................................... 3-1 3-2. Audio Block Diagram..................................................... 3-3 3-3. FL/FR Block Diag ram.................................................... 3-5 3-4. Power 1 Bloc k Diagram................................................. 3-7 3-5. Power 2 Bloc k Diagram................................................. 3-9 3-6. Power 3 Block Diagram ................................................. 3-11 4. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS 4-1. Frame Schematic Diag ram............................................ 4-1 4-2. Printed Wiring Boards and Schematic Diagrams ......... 4-5 A U-258 (ANALOG AUDIO) Schematic Diag ram........... 4-5 A U-258 Printed Wiring Board ........................................ 4-7 FL-180 (1/2) (INDICATOR DRIVE) Schematic Diagram ....................................................... 4-11 FL-180 (2/2) (DOOR DRIVE) Schematic Diagram ....................................................... 4-13 FL-180 Printed Wiring Board ........................................ 4-15 FR-276 Printed Wiring Board ........................................ 4-19 FR-276 (LED DRIVE, FUNCTION KEY) Schematic Diagram ....................................................... 4-23 IR-063 (CONNECTOR) Schematic Diagram ....................................................... 4-25 IR-063 Printed Wiring Board ......................................... 4-26 5. TROUBLESHOOTING Main Set, Power Supply Section ................................... 5-1 Operation&Display Section ........................................... 5-9 A udio Section ................................................................ 5-13 FL Section ..................................................................... 5-14 6. REPAIR PARTS LIST 6-1. Exploded Views ............................................................. 6-1 6-1-1. Case Assy ................................................................ 6-1 6-1-2. Main Chassis Block .................................................. 6-2 6-1-3. Main Block ................................................................ 6-3 6-2. Electrical Par ts List....................................................... 6-4