Sony 16252256 service manual

Page 1

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'SEHv'Ic'E MANUAL mm,

TABLE OF CONTENTS
Service Notes .............................................................................. 2
1. DISASSEMBLY ....................................................... 3
2. DIAGRAMS
2-1. Printed Wiring Boards

2-2, Schematic Diagram .......
2-3. 1C Pin Function Description

. 6
9
15

3. EXPLODED VIEWS ................................................... 23
4. ELECTRICAL PARTS LIST .................................... 25

MINIDISC MECHANISM
S ONY;

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SERVICING NOTES

NOTES ON CHECKING LASER DIODE EMISSION
Never look into the laser diode from the top when checking its emis-
sion during adjustment, otherwise you can loose your eyesight.

NOTES ON HANDLING OPTICAL PICK-UP (KMS-193)
Bridge with a solder the laser tap on flexible board when handling
the optical pick easily destroyed with static electricity. Also, take further action to
prevent electrostatic destruction. The flexible board is very dam-
ageable, requiring a gentle handling.

Q

?

Laser lap

||||||l|ll||

Optical pick-up flexible board

CAUTION

Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.

SAFETY-RELATED COMPONENT WARNING}!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

Flexible Circuit Board Repairing

0 Keep the temperature of the soldering iron around 270 °C during
repairing.

0 Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times),

0 Be careful not to apply force on the conductor when soldering or
unsoldering,

Notes on chip component replacement

- Never reuse a disconnected chip component.

0 Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.