Philips mcd 900 service manual
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1. Technical Specifications, Directions for Use Index of this chapter: 1.1 Technical Specifications 1.2 Directions for Use Notes: - Figures can deviate due to the different set executions. - Specifications are indicative (subject to change). 1.1 Technical Specifications For on-line product support please use the following website: http://www.p4c.philips.com/cgi-bin/dcbint/cpproduct_selector.pl Here is product information available, as well as getting started, user manuals, frequently asked questions and software & drivers. 1.2 Directions for Use You can download this information from the following websites: http://www.philips.com/support http://www.p4c.philips.com 1 - 2
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2. Safety Instructions, Warnings, Notes, and Abbreviation List Index of this chapter: 2.1 Safety Instructions 2.2 Warnings 2.3 Notes 2.4 Abbreviation List 2.1 Safety Instructions Safety regulations require the following during a repair: - Connect the set to the Mains/AC Power via an isolation transformer (> 800 VA). - Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points: - Route the wire trees correctly and fix them with the mounted cable clamps. - Check the insulation of the Mains/AC Power lead for external damage. - Check the strain relief of the Mains/AC Power cord for proper function. - Check the electrical DC resistance between the Mains/AC Power plug and the secondary side (only for sets that have a Mains/AC Power isolated power supply): 1. Unplug the Mains/AC Power cord and connect a wire between the two pins of the Mains/AC Power plug. 2. Set the Mains/AC Power switch to the on position (keep the Mains/AC Power cord unplugged!). 3. Measure the resistance value between the pins of the Mains/AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 M and 12 M . 4. Switch off the set, and remove the wire between the two pins of the Mains/AC Power plug. - Check the cabinet for defects, to prevent touching of any inner parts by the customer. 2.2 Warnings - All ICs and many other semic onductors are susceptible to electrostatic discharges (ESD ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential. - Be careful during measurements in the high voltage section. - Never replace modules or other components while the unit is switched on. - When you align the set, use plastic rather than metal tools. This will prevent any short circuits and the danger of a circuit becoming unstable. 2.3 Notes 2.3.1 General - Measure the voltages and waveforms with regard to the chassis (= tuner) ground ( ), or hot ground ( ), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the Service Default Mode (see chapter 5) with a colour bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or 61.25 MHz for NTSC (channel 3). - Where necessary, measure the waveforms and voltages with ( ) and without ( ) aerial signal. Measure the voltages in the power supply section both in normal operation ( ) and in stand-by ( ). These values are indicated by means of the appropriate symbols. 2.3.2 Schematic Notes - All resistor values are in ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 k ). - Resistor values with no multiplier may be indicated with either an E or an R (e.g. 220E or 220R indicates 220 ). - All capacitor values are given in micro-farads ( 10 -6), nano-farads (n 10 -9), or pico-farads (p 10 -12). - Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF). - An asterisk (*) indicates component usage varies. Refer to the diversity tables for the correct values. - The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt. 2.3.3 BGA (Ball Grid Array) ICs Introduction For more information on how to handle BGA devices, visit this URL: www.atyourservice.ce.philips.com (needs subscription, not available for all regions). After login, select Magazine, then go to Repair downloads. Here you will find Information on how to deal with BGA-ICs. BGA Temperature Profiles For BGA-ICs, you must use the correct temperature-profile, which is coupled to the 12NC. For an overview of these profiles, visit the website www.atyourservice.ce.philips.com (needs subscription, but is not available for all regions) You will find this and more technical information within the Magazine, chapter Repair downloads. For additional questions please contact your local repair help desk. 2.3.4 Lead-free Soldering Due to lead-free technology some rules have to be respected by the workshop during a repair: - Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free so lder paste is required, please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle. - Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able: – To reach a solder-tip temperature of at least 400°C. – To stabilize the adjusted temperature at the solder-tip. – To exchange solder-tips for different applications. - Adjust your solder tool so that a temperature of around 360°C - 380°C is reached and stabilized at the solder joint. Heating time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C, otherwise wear-out of tips will increase drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch off unused equipment or reduce heat. - Mix of lead-free soldering ti n/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If this cannot be avoided, carefully clear the solder-joint from old tin and re-solder with new tin. 1 - 3