Onkyo DXG 10 Service Manual

Page 1

SERIAL NO. 3304

ONKYO® SERVICE MANUAL

COMPACT DISC PLAYER
MODEL DX-G1O

Black model
BUDN, BUD [20V AC, 60 Hz
BUG 220V AC, 50Hz
BUU, BUUX llONlZO/ZZOfilOV AC, SO/GOHZ
BUQA, BUQB 240V AC, 50 Hz
SAFETY-RELATED COMPONENT WARNING SPECIFICATIONS
COMPONENTS IDENTIFIED BY MARK A ON THE Signal readout system: Optical non-contact
SCHEMATIC DIAGRAM AND IN THE PARTS LIST ARE Reading rotation: About 500~200 imprm.
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK, (constant linear velocity)
REPLACE THESE COMPONENTS WITH ONKYO PARTS Linear velocity: 1.Z~l .4m/s
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS Error correction system: Cross interleave readsolomon code
MANUAL. Decoded bits: 18 bits linear
Sampling frequency: 352.8kHz (8 times oversampling)
MAKE LEAKAGECURRENT OR RESISTANCE MEA- Number of channels: 2 (stereo)
SUREMENTS TO DETERMINE THAT EXPOSED PARTS Frequency response: 2HZ~20kHZ
ARE ACCEPTABLY INSULATED FROM THE SUPPLY Total harmonic distortion:0.00lS% (at IkHZ)
CIRCUIT BEFORE RETURNING THE APPLIANCE T0 Dynamic range: 103dB
THE CUSTOMER. Signal to noise ratio: llOdB
Channel separation: 103dB (at lkHz)
Wow and Flutter: Below threshold of measurability
Power comsumption: 24 watts
Output level. 2 volts r.m.s.

Dimensions (W x H x D): 477 x 142 x 427mm
183/4 X 59/16 x16-13/16"
Weight: 27kg, 59.5 lbs.

Specifications are subject to change without notice.

/

ONKYO
I IIIIIIIII chPnumIs

Page 2

TABLE OF CONTENTS

Specifications ......................... 1
Service procedures ....................... 2
Caution on replacement of pick-up ............ 3
Protection of eyes from laser beem

during servicing ....................... 4
Laser warning labels ..................... 4
Notes on compact disc ..................... 5
Disassembling procedures ................... 6
Circuit descriptions ....................... 8
1C block diagram and descriptions ............ 14
Adjustment procedures ................... 23
Mechanism exploded view ................. 27
Chassis exploded View .................... 30
Printed circuit board view ................. 33
Pc board parts list ....................... 35
Schematic diagram ..................... 4O
Waveform of each section .................. 45
Troubleshooting guide .................... 47
Block diagram ......................... 49
Packing view .......................... 50

SERVICE PROCEDURES

1. How to Release the Transport book
To protect the optical assembly including the laser
pickup from vibration related damage during ship-
ping, this unit is equipped with a transport lock lever

located on the base.
}/ Phillips screwdriver

at

Lock lever

? Fig. 1

1. Loosen the screws with, a Phillips screwdriver.

2. Move the lock lever in the direction of the arrow
as far as it Wlll go.

3. Tighten the screw to secure the lock lever.

O For shipping, restore the lock lever to its posir
tion in the opposite direction from the arrow,
then tighten down the screw to secure the lock
lever in that position.

2. Procedures for replacement of flat packaged le
1. Tools to be used:
(1) Soldering iron . . . . Grounded soldering iron or

soldering iron With leak re-

sistance of 10 Mohms or
more.
Form of soldering irons tip:
m} 2
(2) Mngmfyingglnss . ., for checking of finished
works
(3) Tweezers ........ for handling of IC and

forming of leads

(4) Groundingring . . . . Countermeasure for electro-
static breakdown

(5) Nipper ......... for removing defective [C

(6) Small bnish ...... {or application of flux

(7) Enamel line

2. Work Procedures:
(1) Remove the defective lC
Cut all leads of the defective lC one by one using
a nipper and remove the 1C.
1. An enamel line has been pierced between the legs
of the flat package IC.
2. Use a soldering iron to unsolder the legs one at
a time.
3. Repeat the procedure of l and 2 above for the 3
sides only.

~ Fig. 3

While holding the soldering against the enamel line,
pull in the direction of the arrow

(2) Clean the pattern surface of the PC board,
Get rid of the remaining leads and solder,

(3) Check and from the leads of the new flat packs
aged IC to be installed.
From every lead on the new [C using a pair of
tweezers, so that all of them are aligned neatly
without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed with greatest care.

IC SE IC g g '0 %/
(Twisting)

Fig. 4

(Rising) (Incliningl

(4) Apply flux to the PC board.

Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the lC's leads are to
be soldered.

Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.

eg

About 2.5 mm

Fig. 5

Page 15

CXA1082A

O (Servo Signal Processor)

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Pin No, Symbol Function Pin No. Symbol Function
Insert the capacitor between this terminal and 28 PDI Input terminal of phase comparator output IDO
2 FGD in 3 when die the high frequency gain of r7 7 - ,!
P p I
focus servo 2l DIRCT
i 7 , i!r 22 XRST
3 F33 Switching terminal of high frequency gain of 23 DATA input terminals for microcomputer and
focus servo 24 XTL interface
25 CLK
4 FLB Time constant switching terminal when raise 33 LOCK
the low frequency gain of focus servo
29 ISET Flow the current to decide the focus search. track
5 F50 jump, and kick height
I I l TAO Operation amplifier output terminals for power i
at; 831680 transistor drive 30 VCOP ; V$O tgee run frequgacy iggrloportion to resistor
va ue etwcen pins an
I
l- ,_ W
6 liEi Inversion input terminal of focus amplifier 1 32 C864 VCO (3.64MH2) out ut terminal
P
r. .
7 SRCH [ Time constant terminal to make the focus 34 MDP Connection tarminal to terminal MD? of -_i
i search waveform CXD1125QZ
ti _ 7 l
Time constant terminal for high frequency gain Connection terminal to terminal MON of
8 TGU switching of tracking 35 MON CXDllZSQZ
t Timc constant terminal for high frequency gain . LPF time constant terminal of CLV servo error
9 TGZ switching of tracking 36 PSW signal
12 TA' Inversion input terminal of tracking amplifier 38 SPDL Inversion input terminal of spindle drive
' - amplifier
13 SL+ Non-inversion input terminal of slcd amplifier
_ _ _ _ 40 WDCK
E15 SL_ Inversion input terminal Of 516d amplifier 2; £821: Input terminals for microcomputer and interface
t I
16 SSTOP Limit switch ON/OFI detector signal terminal 44 DFCT
for disc innermost position detector
1-" - , - 45 TE Tracking error signal input terminal
17 FSET Terminal of peak of phase compensation of focus
tracking and of setting of LPF 46 TZC Tracking zero cross comparator input terminal
18 SENS Output termmals for microcomputer and 47 ATSC Window comparator input terminal for ATSC
20 C.OUT interface detection
27 BW Time constant terminal of loop filter 48 FE Focus error signal input terminal

_15_

Page 18

YM3414 (Eight times over sampling digital filter)

SDIGJ-~-"

COEFFICIENT ROI

DATA ACCUHLATER OVER OUTPUT
SDSV ©-->~ S/P - RAH FLOI
L.R SHIFTER LIIITER BUFFER
BCI CD-J l
TEIPORARV OUTPUT ->-@DLO
KAI BUFFER --'-®DRO
TIIlNE
ADDRESS
CONTROL
, l
1 T
l l
TE SYiES
PIN NO, TERMINAL [/0 DESCRIPTION
1 SHL 0 When one DAC(TD=L):Deglitching signal of left channel (when four
times) When two DAC(TD=H):Deglitching signal of left and right
channels(when eight times)
2 X0 0 Connect the xtal oscillator between XI and X0.
3 X1 I The clock frequency is 384XFs.
4 VDD2 +5V:Power supply terminal for xtal oscillator and deglitching
signal.
5 BC] I Bit clock input terminal.
6 SDSY I Clock shown L/Rch division of input data and input timing.
7 SDI I 16 bits serial data input terminall
l;
8 VDDI +5V:Fower supply terminal for digital signal-
9 DLO 0 When one DAC(TD:L):Output terminal for L/R channel data (When
four times) When two DAC(TD=H):Output terminal for L channel
data (when eight times)
10 DRO O R channel data output terminal,
11 WCO 0 Word clock of output data DLO/DRO.
l2 BCO 0 Bit clock of output data.
13 J VSS Ground terminal
14 l TD I j 1DAC/2DAC selector terminal: lDAC at low. ZDAC at high.
,_ 7 T
15 SYNCS I Asynchronous input jitter absorption synchronous signal.
Synchronous input at high level. SDSY inhibiting at low' level.
16 SHR 0 R channel deglitching signal when one DAC.
NJM59208 (Operation amp) PC8136 (Operation amp) NJM5532DD (Operation amp)
V _ Vcc
OFFSET 1
NULL l: _l NC a m 6 5
lNPUT 2 [E El meura
W saga E 321:" mm It IE 3 V-
er El Vs'
0mm: [5 5 outrun 1H I: EOUTPUT

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